5CEBA4F17C8N
Intel
- Lifecycle
- Active
- Stock
- 2430 PCS
- Package
- FBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Bảng so sánh chi tiết giữa 5CEBA4F17C8N và 5CEBA2F17C7N cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.
Replacement verdict
The 5CEBA2F17C7N is a viable functional replacement candidate for the 5CEBA4F17C8N, sharing the same package, logic family, and core architecture. However, designers must account for reduced logic density and a faster speed grade, which may affect timing closure and resource utilization in existing designs.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F17C8N | 5CEBA2F17C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49000 | 25000 | Determines the amount of programmable logic capacity available for implementing custom digital functions; a major factor in whether a design fits. |
| Total RAM Bits | 3036160 | 1382400 | On-chip memory capacity affects buffering, FIFO depth, and data storage needs; insufficient RAM can prevent a design from fitting. |
| Embedded Multipliers (18x18) | 132 | 66 | Dedicated DSP blocks accelerate multiplication and signal processing; fewer multipliers limit arithmetic-heavy designs. |
| Maximum User I/O | 128 | 128 | Number of available I/O pins constrains external interfacing; both share the same package so I/O count is comparable. |
| Speed Grade | 8 | 7 | Speed grade indicates maximum operating frequency and timing performance; a faster grade may be required to meet timing closure. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Defines the ambient temperature range for reliable operation; both are commercial grade, suitable for similar environments. |
| Package / Pin Count | FBGA-256 | FBGA-256 | Physical footprint and pinout must match for board-level drop-in compatibility; identical package supports direct substitution. |
| Core Supply Voltage | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow the same power delivery network. |
| Series / Family | Cyclone V E | Cyclone V E | Same device family ensures compatible toolchain, IP cores, and configuration methods for design migration. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F17C8N | 5CEBA2F17C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 128 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEBA4F17C8N and 5CEBA2F17C7N are both Intel (formerly Altera) Cyclone V FPGAs in the same 17 mm FBGA package with 256 pins. The primary differences are logic density and speed grade: the 5CEBA4F17C8N offers approximately 49,000 logic elements (LEs) with a speed grade of 8, while the 5CEBA2F17C7N offers approximately 25,000 LEs with a faster speed grade of 7. The 5CEBA4F17C8N also provides more embedded memory and DSP blocks than the 5CEBA2F17C7N.
Yes. Both devices are offered in the same 256-pin FBGA package with a 17 mm body size, so they share the same physical footprint and pinout. However, designers must verify that the specific I/O assignments and transceiver configurations required by their design are supported by both devices before treating them as drop-in replacements.
The 5CEBA2F17C7N has a faster speed grade. In Intel's Cyclone V speed grade nomenclature, a lower number indicates a faster speed grade. The 5CEBA2F17C7N is rated at speed grade 7, while the 5CEBA4F17C8N is rated at speed grade 8. The faster speed grade of the 5CEBA2F17C7N allows higher maximum operating frequencies for the same logic paths.
Not directly. Although both devices share the same package and pinout, the 5CEBA4F17C8N has roughly twice the logic density, more embedded memory, and more DSP blocks than the 5CEBA2F17C7N. A design that utilizes resources beyond the capacity of the 5CEBA2F17C7N cannot be migrated to it without redesign. Additionally, the speed grade difference affects timing closure and must be re-validated.
The 5CEBA4F17C8N contains approximately 49,000 logic elements (LEs). The 5CEBA2F17C7N contains approximately 25,000 logic elements (LEs). These values are based on Intel's Cyclone V device family specifications for the A4 and A2 density variants, respectively.
Both devices belong to the Cyclone V E family and support similar configuration schemes, including active serial, passive serial, and JTAG. However, the number of available transceivers and high-speed interfaces may differ between the A4 and A2 density variants. Designers should consult the Intel Cyclone V Device Handbook for the specific transceiver and I/O capabilities of each density grade.
The 5CEBA2F17C7N, with its lower logic density and smaller die, is generally more suitable for cost-sensitive and lower-power designs that do not require the additional logic, memory, and DSP resources of the 5CEBA4F17C8N. The 5CEBA4F17C8N is intended for designs requiring higher integration and more processing resources.
Both the 5CEBA4F17C8N and 5CEBA2F17C7N are offered in commercial temperature grade (0°C to 85°C junction temperature) and are RoHS-compliant lead-free packages, as specified in Intel's Cyclone V ordering information. Designers should confirm the exact ordering code and environmental specifications with the manufacturer or authorized distributor before finalizing a bill of materials.