5CEBA4F17I7N
Intel
- Lifecycle
- Active
- Stock
- 1863 PCS
- Package
- FBGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Bảng so sánh chi tiết giữa 5CEBA4F17I7N và 5CEBA2F17C7N cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.
Replacement verdict
The 5CEBA2F17C7N is a viable functional replacement candidate for the 5CEBA4F17I7N in applications where reduced logic density and commercial temperature operation are acceptable. Both devices share the same 256-ball FBGA package and Cyclone V FPGA architecture, ensuring footprint compatibility. However, the 5CEBA4F17I7N offers approximately double the logic elements and industrial temperature support, making it the higher-specification device. Designers must validate logic utilization and thermal requirements before substituting.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F17I7N | 5CEBA2F17C7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 49000 | 25000 | Determines the amount of programmable logic capacity available for implementing custom digital functions; a major factor in whether a design fits. |
| Total Embedded RAM | 3036160 bits | 1382400 bits | On-chip memory capacity affects buffering, FIFO depth, and data storage needs; insufficient RAM can prevent a design from being ported. |
| Embedded 18x18 Multipliers | 132 | 66 | Dedicated multiplier blocks are essential for DSP, filtering, and arithmetic-heavy designs; fewer multipliers can limit signal-processing throughput. |
| Maximum User I/O | 128 | 128 | I/O count determines how many external signals and peripherals can be interfaced; matching counts supports similar board-level connectivity. |
| Package | FBGA-256 | FBGA-256 | Package type and footprint must match for physical board compatibility and assembly; identical packages simplify drop-in replacement. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial-grade parts are required for extended-temperature applications. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | Speed grade influences maximum operating frequency and timing closure; matching grades ensures comparable performance. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow the same power delivery network to be used. |
| Configuration Memory Type | SRAM-based (volatile) | SRAM-based (volatile) | Volatile configuration requires external configuration memory at power-up; both parts share the same boot and configuration scheme. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F17I7N | 5CEBA2F17C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 128 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) Cyclone V F-series field-programmable gate arrays (FPGAs) in the 17 mm FBGA package with 256 pins. The 5CEBA4F17I7N is a Cyclone V E A4 variant with an industrial temperature grade, while the 5CEBA2F17C7N is a Cyclone V E A2 variant with a commercial temperature grade.
The 5CEBA4F17I7N provides approximately 49,000 logic elements (LEs), whereas the 5CEBA2F17C7N provides approximately 25,000 LEs. The A4 device therefore offers roughly twice the logic capacity of the A2 device.
The 5CEBA4F17I7N is rated for industrial temperature operation, typically -40°C to 100°C junction temperature. The 5CEBA2F17C7N is rated for commercial temperature operation, typically 0°C to 85°C junction temperature. The industrial-grade device is suitable for harsher environments.
Yes, both devices use the same 256-pin FBGA package with a 17 mm body size and identical pinout for the Cyclone V E F17 package. This allows a common PCB footprint, but designers must verify power, configuration, and I/O requirements for the specific device.
The 5CEBA4F17I7N has a speed grade of 7 (industrial), while the 5CEBA2F17C7N has a speed grade of 7 (commercial). Both are speed grade 7 devices, but the industrial version may have different timing characteristics over the extended temperature range.
No, they are not direct drop-in replacements. The 5CEBA4F17I7N has higher logic density and an industrial temperature grade, while the 5CEBA2F17C7N has lower logic density and a commercial temperature grade. A design migration requires recompilation, timing analysis, and validation against the target device.
Both devices require a core voltage (VCC) of 1.1 V, I/O voltages (VCCIO) that depend on bank configuration (typically 1.2 V to 3.3 V), and auxiliary voltages such as VCCAUX and VCCPD. Exact supply rails and tolerances must be verified from the Intel Cyclone V device datasheet.
Yes, both the 5CEBA4F17I7N and 5CEBA2F17C7N support active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration schemes as part of the Cyclone V family. Configuration file sizes differ due to different logic densities.