5CEFA7F23I7N vs 5CEFA2F23I7

The primary difference is logic density. The 5CEFA7F23I7N is a Cyclone V E FPGA with 149,500 logic elements (LEs), while the 5CEFA2F23I7 is a Cyclone V E FPGA with 25,000 LEs. Both devices are offered in the same 484-pin FBGA package (23 mm x 23 mm) and share the same I7 speed grade and industrial temperature range, but the 5CEFA7F23I7N provides significantly more adaptive logic modules, embedded memory, and DSP resources.

Yes. Both devices are members of the Intel (formerly Altera) Cyclone V E family and are housed in the identical F23 package, which is a 484-pin FineLine BGA (FBGA) with a 1.0 mm ball pitch. However, pin-compatibility does not guarantee functional equivalence; the 5CEFA7F23I7N may use additional I/O banks or transceiver channels that are not bonded out or active on the 5CEFA2F23I7. Always verify the pin-out and I/O assignment in the respective device pin-out files before designing a common PCB footprint.

No. Although the package and pin-out are compatible, the 5CEFA2F23I7 has only 25,000 LEs versus 149,500 LEs in the 5CEFA7F23I7N. A design that fully utilizes the logic, memory, or DSP resources of the 5CEFA7F23I7N will not fit into the smaller device. Additionally, the maximum operating frequency and available transceiver channels may differ. A direct replacement requires a complete re-compilation and timing analysis to confirm that the target design fits and meets performance requirements.

Both the 5CEFA7F23I7N and 5CEFA2F23I7 belong to the Cyclone V E family, which does not include high-speed serial transceivers. Cyclone V E devices support only general-purpose I/O and LVDS, not multi-gigabit transceivers. Therefore, neither device supports protocols such as PCI Express, SATA, or 10G Ethernet via dedicated transceivers. Any high-speed serial interface must be implemented with external components or soft IP.

The 5CEFA7F23I7N provides 7,640 Kbits of embedded M10K memory and 312 variable-precision DSP blocks. The 5CEFA2F23I7 provides 1,400 Kbits of M10K memory and 66 DSP blocks. These differences directly affect the ability to implement large buffers, video frame stores, or complex signal-processing algorithms. Designs requiring more than 1,400 Kbits of on-chip memory or more than 66 DSP blocks cannot be implemented in the 5CEFA2F23I7.

Yes. Both part numbers include the "I7" suffix, which indicates an industrial temperature range (–40°C to +100°C junction temperature) and speed grade 7. The "N" suffix on the 5CEFA7F23I7N indicates lead-free (RoHS-compliant) packaging. The 5CEFA2F23I7 without the "N" suffix may be supplied in either leaded or lead-free packaging depending on the manufacturer's revision; always confirm the specific ordering code and environmental compliance from the official Intel datasheet or a trusted distributor such as DigiKey or Mouser.

Both devices support the same configuration schemes: active serial (AS) from a serial configuration device, passive serial (PS), fast passive parallel (FPP), and JTAG. They also support partial reconfiguration and remote system upgrade. The configuration bitstream size differs because the 5CEFA7F23I7N contains more logic and memory. The configuration file for the 5CEFA7F23I7N is larger and requires a larger configuration device or longer configuration time compared to the 5CEFA2F23I7.

For a new design with moderate logic requirements, the 5CEFA2F23I7 is typically more cost-effective and sufficient if the design uses fewer than 25,000 LEs, less than 1,400 Kbits of embedded memory, and fewer than 66 DSP blocks. The 5CEFA7F23I7N should be selected when the design requires higher logic density, more embedded memory, or more DSP resources, or when future design expansion is anticipated. Both devices share the same package and pin-out, allowing a migration path from the smaller to the larger device if the PCB is designed to accommodate the larger device's power and I/O requirements.