Part A
5CEFA9F23I7N
Intel
- Lifecycle
- Active
- Stock
- 4366 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F23I7N and 5CEFA2M13C6N are not drop-in replacements for each other. They differ fundamentally in logic density, package footprint, and operating temperature grade, making them suitable for different design requirements rather than interchangeable use.
Different logic density
Different package footprint
Different temperature grade
Different speed grade
Parts at a glance
Part B
5CEFA2M13C6N
Intel
- Lifecycle
- Active
- Stock
- 4768 PCS
- Package
- TFBGA-383
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E FPGA | Cyclone V E FPGA | Both belong to the same Cyclone V E family, so they share architecture, IP, and toolchain support, which simplifies design migration. |
| Logic Elements (LE) | 301,000 | 25,000 | Logic capacity determines how much digital logic can be implemented; a large difference means the two devices are not functionally substitutable for complex designs. |
| Adaptive Logic Modules (ALM) | 113,560 | 9,430 | ALMs are the fundamental building blocks; the count directly reflects the available programmable resources. |
| Embedded Memory (M10K) | 12,200 Kb | 1,400 Kb | On-chip memory affects buffering, FIFO depth, and data storage capability; a mismatch limits memory-intensive applications. |
| 18x18 Multipliers | 684 | 72 | Dedicated multipliers are essential for DSP and arithmetic-heavy designs; fewer multipliers constrain signal processing throughput. |
| Maximum User I/O | 480 | 224 | I/O count determines how many external interfaces and peripherals can be connected, affecting board-level compatibility. |
| Package | FBGA-484 | MBGA-383 | Different packages have different footprints and pinouts, so they are not drop-in replacements on the same PCB. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial-grade parts are required for extended-temperature applications. |
| Speed Grade | 7 (Fastest) | 6 (Faster) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet performance targets. |
| Core Supply Voltage | 1.1 V | 1.1 V | Identical core voltage means power supply design and decoupling requirements are compatible between the two devices. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F23I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F23I7N and the 5CEFA2M13C6N?
The 5CEFA9F23I7N is a Cyclone V FPGA with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers in a 484-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C) and speed grade 7. The 5CEFA2M13C6N is a Cyclone V FPGA with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C) and speed grade 6. The 5CEFA9F23I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2M13C6N provides a smaller footprint and lower power for cost-sensitive applications.
Are the 5CEFA9F23I7N and 5CEFA2M13C6N pin-to-pin compatible?
No. The 5CEFA9F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13C6N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The package sizes, ball counts, and ball maps differ, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB without a redesign.
Can the 5CEFA2M13C6N be used as a direct replacement for the 5CEFA9F23I7N?
No. The two devices differ in logic density (25,000 vs 301,000 logic elements), embedded memory (1,864 Kbits vs 13,917 Kbits), DSP blocks (72 vs 480 multipliers), package type, pin count, and temperature grade. A direct replacement is not possible without verifying that the target design fits within the smaller device resources and adapting the PCB to the different package footprint.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F23I7N is specified for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2M13C6N is specified for commercial temperature range with a junction temperature (TJ) of 0°C to 85°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled-environment applications.
Which device offers higher logic density and embedded memory?
The 5CEFA9F23I7N offers higher logic density and embedded memory. It contains 301,000 logic elements and 13,917 Kbits of embedded memory, compared to 25,000 logic elements and 1,864 Kbits of embedded memory in the 5CEFA2M13C6N. The 5CEFA9F23I7N is therefore better suited for complex, resource-intensive designs, while the 5CEFA2M13C6N targets lower-density applications.
Do both devices belong to the same FPGA family and use the same configuration method?
Yes. Both the 5CEFA9F23I7N and the 5CEFA2M13C6N are members of the Intel (formerly Altera) Cyclone V FPGA family. They support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration, using external configuration devices or a host controller. However, the configuration bitstream size differs due to the different logic densities.
What speed grades are available for these two parts?
The 5CEFA9F23I7N is specified with speed grade 7, which is a slower speed grade in the Cyclone V family. The 5CEFA2M13C6N is specified with speed grade 6, which is a faster speed grade. Speed grade affects timing performance, power consumption, and maximum operating frequency; the 5CEFA2M13C6N can achieve higher clock frequencies for a given design, while the 5CEFA9F23I7N prioritizes higher logic capacity over raw speed.
Which device is more suitable for low-power or space-constrained designs?
The 5CEFA2M13C6N is more suitable for low-power and space-constrained designs. It uses a 383-pin Micro FBGA package measuring 13 mm x 13 mm, which is significantly smaller than the 484-pin FBGA package (23 mm x 23 mm) of the 5CEFA9F23I7N. Additionally, the lower logic density and commercial temperature grade of the 5CEFA2M13C6N generally result in lower static and dynamic power consumption.