ADM3050EBRWZ vs ADM3056EBRIZ-RL

Bảng so sánh chi tiết giữa ADM3050EBRWZ và ADM3056EBRIZ-RL cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The ADM3050EBRWZ and ADM3056EBRIZ-RL are both isolated CAN transceivers from the same ADI family and share core signal-chain characteristics, but they differ in isolation rating, package, and regulatory certification scope. The ADM3056EBRIZ-RL is a viable functional substitute for the ADM3050EBRWZ only after confirming the isolation voltage margin, creepage/clearance, and certification requirements of the target design.

Isolation Voltage Rating Validation required
Package Type Validation required
Data Rate High match
Supply Voltage High match

Parts at a glance

Part A

ADM3050EBRWZ

Công ty Analog Devices Inc.

Lifecycle
Active
Stock
5661 PCS
Package
SOIC-16
Series
Interface - Drivers, Receivers, Transceivers
Part B

ADM3056EBRIZ-RL

Công ty Analog Devices Inc.

Lifecycle
Active
Stock
3943 PCS
Package
SOIC-16
Series
Interface - Drivers, Receivers, Transceivers

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter ADM3050EBRWZ ADM3056EBRIZ-RL Why it matters
Data Rate 12 Mbps 12 Mbps Maximum bus speed supported; both meet the same CAN FD fast data rate, so timing compatibility is equivalent.
Isolation Rating 5 kV rms 5 kV rms Galvanic isolation level protects the bus side from high voltages; identical ratings mean equivalent safety margin.
Supply Voltage (VCC) 5 V (single supply) 5 V (single supply) Determines power rail requirements; both use a single 5 V supply, simplifying drop-in replacement.
Package / Mounting 16-Lead SOIC_W (wide body), surface mount 16-Lead SOIC_W (wide body), surface mount Footprint and assembly compatibility; matching package allows PCB reuse without layout changes.
Operating Temperature Range -40 °C to +125 °C -40 °C to +125 °C Industrial temperature range ensures reliable operation in harsh environments; identical ranges mean equal thermal capability.
Number of Channels 1 Tx / 1 Rx (transceiver) 1 Tx / 1 Rx (transceiver) Channel configuration defines bus interface capability; both provide a single bidirectional CAN channel.
Integrated Isolated DC-DC Yes (isoPower) Yes (isoPower) On-chip isolated power eliminates external supplies; both integrate it, so system complexity is equivalent.
Common-Mode Transient Immunity 100 kV/µs (typical) 100 kV/µs (typical) High CMTI ensures data integrity in noisy industrial environments; matching values indicate equivalent noise immunity.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification ADM3050EBRWZ ADM3056EBRIZ-RL
Supplier - Analog Devices Inc.
Series iCoupler® iCoupler®
Part Status Active Active
Type Transceiver, Isolated Transceiver, Isolated
Protocol CAN CAN
Number of Drivers/Receivers 1/1 1/1
Data Rate 12Mbps 12Mbps
Voltage - Supply 0.5V ~ 6V 0.5V ~ 6V
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount

Frequently asked questions

What are the key differences between the ADM3050EBRWZ and the ADM3056EBRIZ-RL?

The ADM3050EBRWZ is a 5 kV rms isolated CAN transceiver in a 16-lead SOIC_W package, while the ADM3056EBRIZ-RL is a 5 kV rms isolated CAN FD transceiver in a 20-lead SOIC_W package with an integrated isolated DC-to-DC converter. The ADM3056E supports CAN FD data rates up to 12 Mbps and provides an isolated power output, whereas the ADM3050E is a signal-only isolator requiring an external isolated supply.

Are the ADM3050EBRWZ and ADM3056EBRIZ-RL pin-to-pin compatible?

No. The ADM3050EBRWZ uses a 16-lead SOIC_W package, and the ADM3056EBRIZ-RL uses a 20-lead SOIC_W package. The different pin counts and pin functions prevent direct pin-to-pin substitution; the PCB land pattern must be redesigned.

Do both devices support CAN FD?

No. The ADM3056EBRIZ-RL is specified for CAN FD operation with data rates up to 12 Mbps. The ADM3050EBRWZ is a classic CAN transceiver rated for data rates up to 1 Mbps and is not specified for CAN FD.

Does the ADM3056EBRIZ-RL include isolated power, and does the ADM3050EBRWZ?

The ADM3056EBRIZ-RL integrates an isolated DC-to-DC converter that supplies isolated power to the bus side, eliminating the need for a separate isolated supply. The ADM3050EBRWZ does not include an isolated power converter and requires an external isolated supply for the bus-side circuitry.

What is the isolation rating of each device?

Both the ADM3050EBRWZ and the ADM3056EBRIZ-RL are rated for 5 kV rms isolation, suitable for reinforced isolation requirements in industrial CAN networks.

What are the supply voltage requirements for each part?

The ADM3050EBRWZ operates from a single 5 V supply on the logic side and requires an external isolated supply for the bus side. The ADM3056EBRIZ-RL operates from a 5 V supply and generates its own isolated bus-side power through the integrated DC-to-DC converter, so no external isolated supply is needed.

Which device is better suited for space-constrained designs?

The ADM3050EBRWZ occupies a smaller 16-lead SOIC_W footprint and is preferable when board space is limited and an external isolated supply is already available. The ADM3056EBRIZ-RL uses a larger 20-lead SOIC_W package but eliminates the external isolated supply, which can reduce total system footprint and component count.

Can the ADM3050EBRWZ be used as a drop-in replacement for the ADM3056EBRIZ-RL?

No. The devices differ in package, pinout, CAN FD support, and isolated power integration. A direct drop-in replacement is not possible; the design must be revalidated for package footprint, power architecture, and data-rate requirements.