5CEFA2F23C7N

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5CEFA2F23C7N

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IC FPGA 224 I/O 484FBGA

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Thông số kỹ thuật

thuộc tính Giá trị
Series Cyclone® V E
Part Status Active
Digi Key Programmable Not Verified
Total RAM Bits 2002944
Number of I/O 224
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number 5CEFA2
Number of Logic Elements / Cells 25000
Number of LA Bs / CL Bs 9434

Tổng quan

Description

5CEFA2F23C7N appears to be a unique identifier or code, possibly related to a specific product, service, or system. Without further context, it’s challenging to provide a detailed introduction. If this code pertains to a particular domain—such as technology, finance, or logistics—it may represent a model number, transaction ID, or a classification in a database.
To understand its significance, one would typically look for associated documentation, manuals, or databases that elucidate its purpose. If you have more specifics about the context in which 5CEFA2F23C7N is used, I could offer a more tailored explanation or overview.

Equivalent

The 5CEFA2F23C7N chip is part of Altera's Cyclone V FPGA family. Equivalent products include:
1. Xilinx Artix-7 series
2. Lattice ECP5 series
3. Microsemi SmartFusion2
These alternatives may vary in performance, density, and features, so it's important to review specific requirements before selection.

Features

The 5CEFA2F23C7N is a versatile and efficient component commonly used in various electronic applications. While specific details may vary based on its exact model and manufacturer, key features typically include:
1. High Efficiency: Designed to optimize power usage, reducing energy consumption and enhancing performance.
2. Compact Size: Its small form factor allows for easy integration into tight spaces in electronic devices.
3. Robust Performance: Capable of handling a range of operating conditions, ensuring reliability in various applications.
4. Versatile Compatibility: Often compatible with various systems, making it suitable for multiple industries such as consumer electronics, automotive, and industrial automation.
5. Durability: Constructed to withstand wear and tear, contributing to a longer lifespan in operational environments.
For precise specifications and applications, it is advisable to refer to the manufacturer's data sheet or product documentation.

Manufacturer

The manufacturer of the 5CEFA2F23C7N is Intel Corporation. Intel is a multinational technology company headquartered in Santa Clara, California. It is primarily known for designing and manufacturing advanced integrated digital technology platforms, including microprocessors, chipsets, and other semiconductor products. Intel is a leader in the computer hardware industry and plays a crucial role in the development of computing technologies, including personal computers, server systems, and Internet of Things (IoT) solutions. The company also invests heavily in research and development to innovate and improve its product offerings, making it a key player in both the consumer and enterprise technology markets.

Application

The 5CEFA2F23C7N is a 5G NR (New Radio) module primarily used in applications such as IoT devices, smart cities, autonomous vehicles, industrial automation, and remote monitoring systems. Its high-speed connectivity enables real-time data transmission, making it suitable for telemedicine, smart agriculture, and augmented reality applications. The module also supports critical communication systems due to its low latency and reliability, serving industries such as transportation, healthcare, and public safety. Overall, it enhances connectivity across various sectors, facilitating the deployment of advanced technologies and services.

Package

The package type for the 5CEFA2F23C7N is a BGA (Ball Grid Array) package. This type of packaging is commonly used for integrated circuits to provide better performance and thermal management.

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