ACPF-7003-TR1

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ACPF-7003-TR1

+BOM

RF FILTER LOW PASS 1.88GHZ 0805

  • Nhà sản xuấtCông ty TNHH Broadcom

  • Ông. Phần #ACPF-7003-TR1

  • Có sẵn17111

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Thông số kỹ thuật

thuộc tính Giá trị
Part Status Obsolete
Frequency 1.88GHz Center
Bandwidth 60MHz
Filter Type Low Pass
Ripple 2.5dB
Insertion Loss 2.5dB
Mounting Type Surface Mount
Package / Case 0805 (2012 Metric), 4 PC Pad
Size / Dimension 0.079" L x 0.063" W (2.00mm x 1.60mm)
Height (Max) 0.039" (1.00mm)
Packaging Tape & Reel (TR)

Tổng quan

Description

I don’t have a standard description for ACPF-7003-TR1. It appears to be a graduate course code (ACPF) with TR1 possibly indicating Term 1. If you share the institution or the full course title, I can give a precise intro. Meanwhile, here’s a generic intro you can adapt:
“ACPF-7003-TR1 is an advanced module in [field/program]. It introduces key theories, methods, and practical applications of [topic area], develops [specific skills], and prepares students for [next-level work or assessment]. Core topics include [topic 1], [topic 2], and [topic 3]. Prerequisites: [prereqs]. Learning outcomes: [outcomes].”

Pinout

I don’t have the pin count or function for ACPF-7003-TR1 available. Please provide the manufacturer or a link to the datasheet. Once you share it, I can confirm the exact pin count (e.g., 8/14/16 pins) and the device function with a concise pinout summary.

Application

I don’t have a datasheet for ACPF-7003-TR1. If it’s an ACPF family device used in power electronics, typical applications include EMI suppression and filtering in DC-DC/AC-DC power supplies, motor drives, PFC networks, and audio/video circuits. It may also be used in industrial automation and automotive power management. For exact applications, please share the datasheet or the manufacturer.

Package

I don’t have the packaging details for ACPF-7003-TR1. Please specify the manufacturer or share the datasheet link. Check the datasheet or distributor pages (DigiKey/Mouser) for “Package.” The TR suffix often indicates Tape & Reel packaging; the actual package (e.g., SOIC, SOP, QFN) depends on the device.

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