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AP6356S
+BOM-
Nhà sản xuấtJLCPCB Assembly
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Ông. Phần #AP6356S
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Có sẵn28178
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Manufacturer | JLCPCB Assembly |
| Package | SMD-50P |
Tổng quan
Description
Built around the Broadcom BCM4356 chipset, the module is compact and ideal for embedded systems, smart home devices, and industrial applications. It supports SDIO for Wi-Fi and UART/PCM for Bluetooth, ensuring flexible integration.
Key features include:
- Low power consumption
- Advanced security (WPA3, AES encryption)
- Seamless roaming (802.11k/v/r)
- Extended Bluetooth range (LE)
The AP6356S is certified for global regulatory compliance (FCC, CE, etc.), making it suitable for worldwide deployment. Its robust performance and reliability make it a popular choice for modern wireless solutions.
Manufacturer
Qualcomm is a leading American semiconductor and telecommunications company known for its wireless technology innovations, including Snapdragon processors, 5G modems, and IoT solutions. The AP6356S integrates Qualcomm's advanced wireless connectivity features, commonly used in IoT, automotive, and consumer electronics for reliable Wi-Fi 6 and Bluetooth 5.1 performance.
Qualcomm is a global leader in mobile and wireless technologies, supplying chipsets to major smartphone, automotive, and networking manufacturers.
Application
1. Smart Home Devices – IoT gadgets, smart speakers, and lighting systems.
2. Consumer Electronics – TVs, set-top boxes, and streaming devices.
3. Industrial IoT – Automation, sensors, and remote monitoring.
4. Automotive – Infotainment and telematics systems.
5. Retail & Healthcare – POS terminals and medical wearables.
It supports dual-band Wi-Fi (2.4GHz/5GHz) and Bluetooth 4.2, ensuring reliable wireless connectivity in embedded applications.