AS4C256M16D3C-12BIN

The AS4C256M16D3C-12BIN is a DDR3 SDRAM memory chip designed for high-performance computing applications. It features a 2Gb capacity, organized as 256M x 16 bits, and operates at a 1.5V supply voltage. This memory module supports a data rate of up to 1600 MT/s (mega-transfers per second), making it suitable for various applications, including servers, laptops, and other computing devices requiring efficient data processing.
The chip utilizes a 64-bit wide data bus and supports multiple modes of operation, including burst mode for faster data access. The AS4C256M16D3C-12BIN adheres to JEDEC standards, ensuring compatibility with various DDR3 memory controllers. Its 12ns cycle time enhances performance, while features like on-die termination (ODT) improve signal integrity and power efficiency.
Overall, this DDR3 SDRAM component is ideal for applications demanding high-speed memory with reliable performance and low power consumption.

The AS4C256M16D3C-12BIN chip is a DDR3 SDRAM memory chip. Equivalent products include:
1. MT41J256M16HA-125
2. H5TQ2G83AFR
3. K4B4G1646D-BCK0
Check specifications for compatibility in terms of voltage, speed, and timing. Always verify with the manufacturer for the most accurate replacements.

The AS4C256M16D3C-12BIN is a 4Gb (256M x 16) DDR3 SDRAM memory chip designed for high-performance applications. Key features include:
1. Organization: 256 Meg x 16 bits.
2. Data Rate: Operates at a speed of DDR3-1600 (PC3-12800).
3. Voltage: Typically operates at 1.5V, with a low power consumption profile.
4. Package: Available in a 78-ball FBGA (Fine Ball Grid Array) package.
5. Latency: Supports CAS latency (CL) of 11, enhancing performance for various applications.
6. Functionality: Designed for applications requiring high bandwidth and low latency, suitable for servers, desktops, and embedded systems.
7. Configuration: Supports burst lengths of 4 and 8, enhancing data transfer efficiency.
8. Temperature Range: Industrial-grade temperature range, allowing for diverse operating conditions.
This chip is ideal for memory-intensive applications, providing reliable performance in both consumer and industrial environments.

The AS4C256M16D3C-12BIN is a DDR3 SDRAM memory chip with a total pin count of 78 pins. It is organized as 256 Meg x 16 bits, and its primary function is to serve as volatile memory for high-performance applications in computing and electronics.
Key features include:
- Memory Type: DDR3 SDRAM
- Density: 256 Megabits
- Data Width: 16 bits
- Package Type: 78-pin TSOP II
- Operating Voltage: Typically 1.5V
- Speed Grade: 12 ns access time
This chip is commonly used in various applications such as laptops, desktops, and servers, providing efficient and high-speed data access.

The AS4C256M16D3C-12BIN is manufactured by Alliance Memory, Inc. Alliance Memory is a company that specializes in the design and production of a variety of memory solutions, including DRAM and SRAM products. Founded in 2006, the company focuses on providing high-quality memory components that are compatible with a wide range of applications in consumer electronics, telecommunications, and industrial sectors. They offer a wide portfolio of legacy memory devices, catering primarily to markets that require cost-effective and reliable memory solutions. Alliance Memory is recognized for its commitment to quality and customer support, making it a notable player in the semiconductor industry.

The AS4C256M16D3C-12BIN is a 256Mbit DDR3 SDRAM chip, primarily used in various applications such as consumer electronics, networking equipment, and industrial automation. It is suited for high-performance memory requirements in devices like smartphones, tablets, laptops, and embedded systems. Additionally, it can be used in servers and storage solutions that demand efficient data processing and high-speed access. Its low power consumption makes it ideal for energy-sensitive applications.

The AS4C256M16D3C-12BIN is a DDR3 SDRAM memory chip, typically packaged in a 78-ball BGA (Ball Grid Array) format. This package type allows for efficient thermal performance and compact design on printed circuit boards.