BCM56229B0IPBG

BCM56229B0IPBG is a Broadcom network switch ASIC (BCM56229) in a BGA package, with B0 indicating the revision/stepping and IPBG the packaging code. It belongs to Broadcom’s BCM56229 family and is used in enterprise and edge networking devices.
Key points:
- Integrated switch fabric with multiple MAC/PHY interfaces
- Supports common L2/L3 switching, QoS, VLANs, multicast, and security features
- Exact port counts, speeds, and capabilities vary by device implementation
Typical applications:
- Small to medium enterprise access/aggregation switches
- Compact routers and other edge networking appliances
What to do for precise specs:
- Consult the official Broadcom datasheet, product brief, and reference manuals for BCM56229B0IPBG
- Access may require Broadcom’s NDA or partner portal; contact Broadcom or your distributor for documentation.

BCM56229B0IPBG is a Broadcom StrataXGS switch/SoC. Typical features (package/version dependent) include:
- High‑performance Layer 2/3 switching with hardware acceleration
- VLANs and 802.1Q, QinQ support; robust STP/RSTP/MSTP
- Link aggregation (LACP) for port-channeling
- Quality of Service (QoS): multiple hardware queues, per‑port/cluster policing and shaping, 802.1p and DSCP support
- Multicast features: IGMP/MLD snooping
- ACLs: hardware‑based L2/L3 ACLs with TCAM
- IPv4/v6 routing (static routes; support for basic dynamic routing features on some SKUs)
- Management: CLI, SNMP (v2/v3), RMON, Syslog, possibly web/REST, remote diagnostics
- Security: storm control, DHCP snooping, port/security features
- Power/thermal: energy‑efficient Ethernet where supported
- Diagnostics: port mirroring, loopback tests, hardware counters
Note: exact port count, PHYs (LAN/WAN mix), SFP options, and feature depth vary by package (IPBG) and firmware. For precise specs, consult the official BCM56229B0IPBG datasheet.

Pin count: 196 pins (IPBG BGA package). Function: Broadcom BCM56229B0 is a Gigabit Ethernet switch/SoC with integrated MACs/PHYs and switch fabric. Note: pin count can vary by exact package revision; verify against the official datasheet for the specific package.

Broadcom Inc. is the manufacturer. Broadcom is a multinational semiconductor and infrastructure software company that designs and supplies a wide range of integrated circuits and software for networking, data centers, wireless, storage, and other technologies. It is a fabless semiconductor company (manufacturing outsourced to foundries).

Broadcom BCM56229B0IPBG is a system-on-chip for networking/communication devices. Typical application areas include:
- Home and small business routers and gateways
- Ethernet switches and wireless access points
- IP surveillance cameras and video devices
- Set-top boxes and multimedia gateways
- VoIP and other communications devices
- Embedded networking modules in broadband modems
Note: For exact specifications and recommended use cases, refer to the official datasheet.

Plastic Ball Grid Array (PBGA) package.