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BGA715L7E6327
+BOMFRONT-END LOW NOISE AMP FOR GPS
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Nhà sản xuấtCông nghệ Infineon
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Ông. Phần #BGA715L7E6327
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Bảng dữ liệu BGA715L7E6327 DataSheet
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Gói XFDFN-6
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Supplier | Rochester Electronics, LLC |
| Package / Case | Bulk |
| Part Status | Active |
| Frequency | 1.9GHz, 2.1GHz |
| P1d B | -8dBm |
| Gain | 17dB |
| Noise Figure | 1.1dB |
| RF Type | UMTS |
| Voltage - Supply | 2.6V ~ 3V |
| Supply Current | 3.6mA |
| Test Frequency | 2.1GHz |
| Mounting Type | Surface Mount |
Tổng quan
Description
The device comes in a compact Ball Grid Array (BGA) package, which is known for its high-density interconnections and reliability in high-frequency applications. Key features generally include low power consumption, high linearity, and robust thermal management to ensure consistent performance in demanding environments.
The BGA715L7E6327 might be used in a variety of devices, including smartphones, tablets, and networking equipment, where it helps in boosting signal strength and improving overall communication reliability. Its precise specifications, such as frequency range, gain, and output power, are crucial for engineers during the design phase to ensure compatibility with specific communication standards and system requirements.
Equivalent
Features
1. Frequency Range: Designed to operate effectively across a wide range of frequencies, often suitable for wireless communication systems.
2. Low Noise Figure: Offers low noise performance, enhancing overall system sensitivity and signal quality.
3. Gain: Provides stable gain, ensuring consistent amplification across the specified frequency range.
4. Power Efficiency: Features optimized power consumption, making it suitable for battery-powered devices.
5. Small Package Size: Comes in a compact BGA package, beneficial for space-constrained applications.
6. Impedance Matching: Typically includes input and output matching for ease of integration into systems.
7. Reliability: Designed for high reliability in various environmental conditions, often with a good temperature range and ESD protection.
8. Application: Suitable for use in mobile devices, wireless infrastructure, and other RF applications.
Please consult the specific datasheet for detailed specifications and operational guidelines.
Pinout
- Pin Count: This device is housed in a 7-pin package.
- Function: It's a member of the RF amplifier family designed primarily for wireless communication applications. The BGA715L7E6327 is used to amplify RF signals, making it suitable for applications like mobile phones, wireless data transmission, and other RF communication systems.
For precise technical details and specific functions, referring to the manufacturer's datasheet or product documentation is recommended. This will provide comprehensive insights into its electrical characteristics, application circuits, and performance parameters.
Manufacturer
Infineon Technologies is a leading player in the semiconductor industry and focuses on segments including automotive, industrial power control, power management, and digital security solutions. The company provides microcontrollers, power semiconductors, sensors, and other components used in various applications, ranging from electric vehicles and industrial automation to cybersecurity and the Internet of Things (IoT). Infineon's products are integral to many sectors, providing solutions that enhance energy efficiency, mobility, and security.