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CSD86330Q3D
+BOMMOSFET 2N-CH 25V 20A 8LSON
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Nhà sản xuấtTexas Dụng cụ
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Ông. Phần #CSD86330Q3D
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Gói 8-PowerLDFN
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Có sẵn3485
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Series | NexFET™ |
| ProductStatus | Active |
| FETType | 2 N-Channel (Half Bridge) |
| FETFeature | Logic Level Gate |
| DraintoSourceVoltage(Vdss) | 25V |
| Current-ContinuousDrain(Id)@25°C | 20A |
| RdsOn(Max)@IdVgs | 9.6mOhm @ 14A, 8V |
| Vgs(th)(Max)@Id | 2.1V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 6.2nC @ 4.5V |
| InputCapacitance(Ciss)(Max)@Vds | 920pF @ 12.5V |
| Power-Max | 6W |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-PowerLDFN |
Tổng quan
Description
Key features:
- Low RDS(on): 1.8mΩ (high-side) and 1.3mΩ (low-side) for reduced conduction losses.
- Fast switching: Minimizes switching losses, improving efficiency.
- Optimized gate charge (Qg): Enhances thermal performance.
- Lead-free and RoHS-compliant.
Ideal for high-current, high-frequency designs requiring compact footprints and energy efficiency.
Equivalent
- Infineon BSC010NE2LS5
- Vishay SiZF300DT
- ON Semiconductor NTMFS5C628NL
These alternatives offer similar specifications like low RDS(on), 30V rating, and power block packaging. Always verify datasheets for exact compatibility.
Features
- Low RDS(on): 1.8 mΩ (max) at VGS = 4.5V, enhancing efficiency.
- High Current Handling: 30A continuous (60A pulsed).
- Optimized Switching: Low Qg (11 nC) and Qgd (2.3 nC) for fast switching.
- Thermal Efficiency: Exposed top for improved heat dissipation.
- Compact Footprint: 3.3mm x 3.3mm SON package, saving board space.
- Logic-Level Drive: Compatible with 3.3V/5V gate drivers.
Ideal for DC-DC converters, POL, and high-density power applications.
Pinout
### Key Functions:
- Dual N-Channel MOSFETs: Designed for synchronous buck converters.
- High Efficiency: Optimized for high-frequency switching (e.g., CPU/GPU power delivery).
- Low RDS(on): Reduces conduction losses.
- Integrated Driver: Simplifies PCB layout and improves thermal performance.
### Pinout Highlights:
- VIN (Pins 1, 12): Power input.
- SW (Pins 2, 11): Switching node.
- GND (Pins 3, 10): Ground.
- LG (Pins 4, 9): Low-side gate drive.
- HG (Pins 5, 8): High-side gate drive.
- BOOT (Pins 6, 7): Bootstrap supply for high-side FET.
Used in POL (Point-of-Load) converters, servers, and high-performance computing.