CYBLE-012011-00

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CYBLE-012011-00

+BOM

RX TXRX MODULE BT TRC ANT SMD

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Thông số kỹ thuật

thuộc tính Giá trị
Package Tape & Reel (TR),Cut Tape (CT)
Series EZ-BLE™ PRoC™
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v4.1
Frequency 2.4GHz ~ 2.48GHz
DataRate 1Mbps
Power-Output 3dBm
Sensitivity -87dBm
SerialInterfaces I²C, SPI, UART
AntennaType Integrated, Trace
MemorySize 128kB Flash, 16kB SRAM
Voltage-Supply 1.8V ~ 5.5V
Current-Receiving 16.4mA
Current-Transmitting 15.6mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 85°C

Tổng quan

Description

CYBLE-012011-00 is a module designed by Cypress Semiconductor, now part of Infineon Technologies, which is used in various wireless communication applications. It is a fully certified Bluetooth Low Energy (BLE) module that serves to facilitate low-power, short-range wireless communication in IoT (Internet of Things) devices.
The module integrates an onboard antenna, RF balun, and passive components, simplifying the development process by reducing the need for external components. This design makes it easier for developers to incorporate BLE functionality into their products without extensive RF design experience.
CYBLE-012011-00 is based on the Cypress PSoC 4 BLE (Programmable System-on-Chip) architecture, which combines a BLE radio with a programmable analog and digital block, allowing for a range of customization options. It supports Bluetooth 4.1 and is ideal for applications requiring low power consumption, such as wearables, health monitoring devices, and smart home applications. Its compact size and robust performance make it suitable for a wide range of wireless communication tasks.

Equivalent

The CYBLE-012011-00 is a Bluetooth Low Energy module from Cypress Semiconductor. Equivalent products might include:
1. Nordic Semiconductor nRF51822 and nRF52832 modules, which offer similar BLE functionality.
2. Texas Instruments CC2541 and CC2640R2F, known for low power Bluetooth applications.
3. Silicon Labs BGM13P, which is another BLE module with a small form factor.
These alternatives provide comparable BLE capabilities and are used in various IoT and wireless communication applications.

Features

The CYBLE-012011-00 is a Bluetooth Low Energy (BLE) module by Cypress Semiconductor, now part of Infineon Technologies. Key features include:
1. Bluetooth Version: Supports Bluetooth 4.2 protocol with Low Energy capabilities, making it suitable for IoT applications.

2. Size: Compact dimensions for easy integration into space-constrained designs.
3. Range: Offers a robust communication range, typically up to 50 meters, depending on the environment and usage conditions.
4. Processor: Integrates a low-power ARM Cortex-M0 processor for efficient power management and processing.
5. Power Consumption: Designed for low power consumption, ideal for battery-operated devices.
6. Interfaces: Provides multiple interfaces, including UART, I2C, and SPI, for versatile connectivity options.
7. Antenna: Features an onboard antenna, reducing the need for external RF components.
8. Certifications: Pre-certified to simplify the regulatory approval process, saving time and cost for developers.
9. Development Support: Supported by comprehensive development tools and resources, facilitating ease of integration and deployment.
These features make the CYBLE-012011-00 suitable for various applications, including health and fitness devices, smart home products, and industrial IoT solutions.

Pinout

The CYBLE-012011-00 is a Bluetooth Low Energy (BLE) module manufactured by Cypress Semiconductor, now part of Infineon Technologies. It features a total of 31 pins. These pins serve multiple functions including:
1. Power Supply: Pins dedicated to VDD (power supply) and GND (ground).
2. I/O Ports: General-purpose input/output (GPIO) pins for interfacing with external components.
3. Serial Communication: Pins for UART, SPI, and I2C interfaces, facilitating communication with other devices.
4. Programming and Debugging: Pins used for programming and debugging the module via SWD (Single-Wire Debug).
5. Analog Functions: Pins for ADC (Analog-to-Digital Converter) inputs, allowing for analog signal processing.
6. Reset: A pin dedicated to reset functionality.
7. Special Functionality: Additional pins for specific functions like wake-up interrupts or PWM (Pulse Width Modulation).
These diverse pin functions make the CYBLE-012011-00 versatile for various applications, particularly in wireless communication solutions where BLE connectivity is required.

Manufacturer

The CYBLE-012011-00 is manufactured by Cypress Semiconductor Corporation. Cypress Semiconductor is a company that specializes in designing and manufacturing semiconductor products for a wide range of applications. They are known for their work in producing microcontrollers, memory chips, and integrated circuits for consumer electronics, industrial, automotive, and Internet of Things (IoT) applications. The company has a strong focus on providing solutions for connectivity, computing, and storage.

Application

The CYBLE-012011-00 is a Bluetooth Low Energy (BLE) module designed for wireless connectivity. Its application areas include:
1. IoT Devices: Used in smart home devices, environmental sensors, and industrial IoT applications.
2. Healthcare: Utilized in wearable health monitors and medical devices for wireless data transmission.
3. Consumer Electronics: Common in fitness trackers, smartwatches, and wireless audio products.
4. Home Automation: Employed in smart lighting, security systems, and HVAC control.
5. Asset Tracking: Facilitates the tracking and management of goods and equipment.
6. Automotive: Integrated into infotainment systems and vehicle connectivity solutions.
The module’s low power consumption and compact size make it ideal for battery-powered wireless applications.

Package

The CYBLE-012011-00 is a Bluetooth Low Energy (BLE) module by Cypress Semiconductor, typically housed in a compact PCB (Printed Circuit Board) package. It's designed for easy integration into IoT devices, offering wireless communication capabilities. The package type facilitates straightforward soldering onto host boards for various applications.

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