DS26LV31TM

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DS26LV31TM

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IC DRIVER 4/0 16SOIC

  • Nhà sản xuấtTexas Dụng cụ

  • Ông. Phần #DS26LV31TM

  • Gói 16-SOIC

  • Có sẵn5396

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Thông số kỹ thuật

thuộc tính Giá trị
Package Tube,Tube
ProductStatus Obsolete
Type Driver
Protocol RS422, RS485
NumberofDrivers/Receivers 4/0
Voltage-Supply 3V ~ 3.6V
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 16-SOIC (0.154, 3.90mm Width)

Tổng quan

Description

The DS26LV31TM is a quad differential line driver designed for high-speed data transmission over balanced lines. It complies with TIA/EIA-422-B and ITU-T V.11 standards, making it ideal for RS-422 applications.
### Key Features:
- High-speed operation: Supports data rates up to 32 Mbps.
- Low-voltage operation: Works with 3.3V power supply.
- Low power consumption: Optimized for energy efficiency.
- Robust ESD protection: Up to ±15kV (HBM) for reliability.
- Wide temperature range: Operates from -40°C to +85°C.
### Applications:
- Industrial communication
- Networking equipment
- Point-to-point data links
The device comes in a TSSOP-16 package, ensuring compact PCB integration. Its differential outputs minimize noise and crosstalk, enhancing signal integrity in long-distance transmissions.
For detailed specs, refer to the datasheet from Texas Instruments (now part of Diodes Incorporated).

Pinout

The DS26LV31TM is a quad differential line driver with 16 pins (SOIC package).
Key Functions:
- Converts 4 single-ended TTL/CMOS inputs into 4 differential outputs (RS-422/485 compatible).
- Operates at 3.3V supply, supporting data rates up to 400 Mbps.
- Features high output current (±50 mA) and low skew for robust signal transmission.
- Includes enable/disable control (pin 15) for output tri-state functionality.
Applications: High-speed data transmission in industrial, telecom, and networking systems.

Package

The DS26LV31TM is a quad differential line driver available in a TSSOP-16 (Thin Shrink Small Outline Package) with 16 pins. It's designed for high-speed data transmission, offering robust performance in industrial and communication applications. The package is compact, surface-mountable, and suitable for space-constrained designs.

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