Hình ảnh chỉ để tham khảo
EG4A20BG256
+BOM-
Nhà sản xuấtJLCPCB Assembly
-
Ông. Phần #EG4A20BG256
-
Có sẵn27784
365 Đảm bảo chất lượng ngày
7*24 giờ dịch vụ quarantee
90-Bảo hành sau bán hàng ngày
Bảo hành sản phẩm chính xác
Thông số kỹ thuật
| thuộc tính | Giá trị |
| Manufacturer | JLCPCB Assembly |
| Package | FBGA-256_17.0X17.0X1.00P |
Tổng quan
Description
- 20K logic elements for flexible digital design.
- 256-pin BGA package, suitable for compact, high-density applications.
- Low-power operation using Efinix’s Quantum™ architecture.
- Embedded DSP blocks and RAM resources for efficient signal processing.
- Support for PCIe, DDR3/4, and MIPI interfaces, ideal for embedded and IoT applications.
It offers a cost-effective, reconfigurable solution for prototyping and production in industries like AI, automotive, and consumer electronics.
Equivalent
- Lattice iCE40 UltraPlus (low-power FPGA)
- Xilinx Artix-7 (higher performance)
- Intel Cyclone IV (mid-range FPGA)
These offer comparable logic capacity and features. For exact replacements, check Efinix's Trion or Titanium series, such as the T20/T35. Always verify pin compatibility and specs for your design.
Features
- 256KB Flash memory for program storage
- 20KB SRAM for data handling
- ARM Cortex-M4 core with FPU (Floating Point Unit) and DSP support
- 72 MHz max clock speed
- Low-power operation with multiple sleep modes
- Rich peripherals:
- 12-bit ADC (Analog-to-Digital Converter)
- DAC (Digital-to-Analog Converter)
- Timers (PWM, Capture/Compare)
- USART, SPI, I2C interfaces
- USB 2.0 Full-Speed support
- 256-pin BGA package for compact designs
- Wide operating voltage (1.8V–3.6V)
- Industrial-grade temperature range (-40°C to +85°C)
Ideal for embedded applications requiring real-time processing, connectivity, and power efficiency.
Pinout
- Logic Elements: 20K LUTs for programmable logic.
- I/O Pins: Supports 3.3V LVCMOS and other standards.
- Memory: Embedded block RAM (EBR) for data storage.
- DSP Blocks: For arithmetic operations.
- PLLs: Clock management.
- Package: 256-ball BGA (Ball Grid Array).
It targets low-power, high-performance applications like edge computing and IoT.
Manufacturer
Application
1. Industrial Automation – Motor control, robotics, and PLCs.
2. Consumer Electronics – Smart displays, wearables, and AI accelerators.
3. Automotive – ADAS, infotainment, and sensor fusion.
4. Communications – 5G, networking, and signal processing.
5. Medical Devices – Portable diagnostics and imaging systems.
Its low power, small footprint, and reprogrammability make it suitable for cost-sensitive, power-efficient designs.