EP3C16F256I7

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EP3C16F256I7

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IC FPGA 168 I/O 256FBGA

  • Nhà sản xuấtIntel

  • Ông. Phần #EP3C16F256I7

  • Gói BGA256

  • Có sẵn3581

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Thông số kỹ thuật

thuộc tính Giá trị
Package Tray
Series Cyclone® III
ProductStatus Active
NumberofLABs/CLBs 963
NumberofLogicElements/Cells 15408
TotalRAMBits 516096
NumberofI/O 168
Voltage-Supply 1.15V ~ 1.25V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Tổng quan

Description

The EP3C16F256I7 is a member of the Cyclone III FPGA family by Intel (formerly Altera). It features 15,408 logic elements (LEs), 56 M9K memory blocks (504 Kbits RAM), and 56 18x18 multipliers for DSP applications. The "F256" denotes a 256-pin FineLine BGA package, while "I7" indicates an industrial-grade (-40°C to 100°C) speed grade 7 device.
Key features include:
- Low-power 65nm process
- Up to 315 user I/O pins
- Support for DDR2/3, LVDS, and other I/O standards
- On-chip PLLs for clock management
It’s suited for cost-sensitive, mid-range applications like industrial control, automotive, and embedded systems. Designers use Quartus II (or newer Intel Quartus Prime) for development.

Equivalent

The EP3C16F256I7 is a Cyclone III FPGA from Intel (formerly Altera). Equivalent alternatives include:
- Lattice ECP3 series (e.g., LFE3-16EA-256FN)
- Xilinx Spartan-6 (e.g., XC6SLX16-2CSG225C)
- Intel Cyclone IV (e.g., EP4CE15F23C8N) for newer designs.
These offer similar logic density (~15K LEs) and features. For exact replacements, verify pin compatibility and specifications.

Features

The EP3C16F256I7 is an Altera Cyclone III FPGA with these key features:
- Logic Elements (LEs): 15,408
- Memory: 504 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- I/O Pins: 179 (supports LVDS, LVCMOS, PCI)
- Package: 256-pin FineLine BGA (FBGA)
- Max User I/O: 179
- Transceivers: None (base Cyclone III lacks high-speed transceivers)
- Clock Management: 4 PLLs
- Operating Voltage: 1.15V–1.25V core, 1.5V/1.8V/2.5V/3.3V I/O
- Temperature Range: Industrial (-40°C to 100°C)
Ideal for cost-sensitive, low-power applications like industrial control, automotive, and consumer electronics.

Pinout

The EP3C16F256I7 is a Cyclone III FPGA from Intel (formerly Altera) with the following key specifications:
- Pin Count: 256 pins (FBGA package)
- Logic Elements (LEs): 15,408
- Memory: 504 Kbits embedded RAM
- I/O Pins: 153 user I/Os (supports LVDS, LVCMOS, and other standards)
- PLLs: 4 phase-locked loops
- Multipliers: 56 (18x18-bit)
Functions include general-purpose logic, DSP operations, memory interfacing, and high-speed I/O support. It is commonly used in embedded systems, communications, and industrial applications.

Manufacturer

The EP3C16F256I7 is a Cyclone III FPGA manufactured by Intel (formerly Altera before its acquisition in 2015).
Intel is a leading multinational technology company specializing in semiconductor design and production, known for processors, FPGAs, and other integrated circuits. Altera, now part of Intel's Programmable Solutions Group (PSG), was a pioneer in programmable logic devices.
The Cyclone III series is a cost- and power-optimized FPGA family for applications like industrial, automotive, and consumer electronics. The EP3C16F256I7 features 15,408 logic elements, 256-pin FineLine BGA packaging, and low-power operation.

Application

The EP3C16F256I7 is a Cyclone III FPGA from Intel (formerly Altera). Its key application areas include:
- Embedded Systems: Used in control and interface logic.
- Industrial Automation: For motor control, PLCs, and sensor processing.
- Communications: Baseband processing and protocol handling.
- Consumer Electronics: Video processing and display controllers.
- Automotive: Infotainment and driver assistance systems.
- Medical Devices: Signal processing and diagnostics.
Its low power, moderate logic density (~15K LEs), and 256-pin FBGA package make it suitable for cost-sensitive, mid-complexity designs.

Package

The EP3C16F256I7 is an FPGA from Intel's Cyclone III family. It comes in a 256-pin FineLine BGA (FBGA) package. This package type is surface-mounted, compact, and suitable for high-density applications. The "F256" in the part number indicates the 256-pin FBGA configuration.

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