Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1539 |
| NumberofLogicElements/Cells | 24624 |
| TotalRAMBits | 608256 |
| NumberofI/O | 156 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Tổng quan
Description
The EP3C25F256I7 is a member of the Cyclone III family of FPGAs (Field-Programmable Gate Arrays) developed by Altera, now part of Intel. This specific model is designed for low-cost, high-volume applications, offering a balance between performance, logic density, and power efficiency.
Key features of the EP3C25F256I7 include:
1. Logic Elements: It contains 24,624 logic elements, making it suitable for moderate complexity designs.
2. I/O Pins: The chip offers 156 available I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes embedded memory blocks, totaling approximately 608 Kbits, for efficient data handling and processing.
4. Package: It is housed in a 256-pin FineLine BGA (Ball Grid Array) package, which offers a compact footprint.
5. Temperature Range: The ‘I7’ suffix indicates it is rated for industrial temperature ranges, from -40°C to 100°C, making it suitable for harsh environments.
The EP3C25F256I7 is ideal for applications in communications, automotive, and consumer electronics, where cost-effective and reliable FPGA solutions are required.
Key features of the EP3C25F256I7 include:
1. Logic Elements: It contains 24,624 logic elements, making it suitable for moderate complexity designs.
2. I/O Pins: The chip offers 156 available I/O pins, providing flexibility for interfacing with various peripherals.
3. Memory: It includes embedded memory blocks, totaling approximately 608 Kbits, for efficient data handling and processing.
4. Package: It is housed in a 256-pin FineLine BGA (Ball Grid Array) package, which offers a compact footprint.
5. Temperature Range: The ‘I7’ suffix indicates it is rated for industrial temperature ranges, from -40°C to 100°C, making it suitable for harsh environments.
The EP3C25F256I7 is ideal for applications in communications, automotive, and consumer electronics, where cost-effective and reliable FPGA solutions are required.
Equivalent
The EP3C25F256I7 is part of Altera's Cyclone III FPGA series. Equivalent products can include other FPGAs with similar logic elements and I/O pins from manufacturers like Xilinx (e.g., Spartan-3 series), Lattice Semiconductor (e.g., LatticeECP3), and Microsemi (e.g., SmartFusion2). It's important to compare specific features like package size, speed grade, and power consumption to ensure compatibility with your application.
Features
The EP3C25F256I7 is a member of the Altera Cyclone III family of FPGAs. Key features include:
1. Logic Elements: It contains 24,624 logic elements, suitable for implementing complex digital circuits.
2. Embedded Memory: The FPGA has 594 Kbits of embedded memory, providing storage for data and instructions.
3. I/O Pins: It offers 182 user I/O pins, providing flexibility for connecting with various peripherals and external devices.
4. Phase-Locked Loops (PLLs): There are 4 PLLs for clock management, useful in applications requiring precise timing and synchronization.
5. Package: It comes in a 256-pin FineLine BGA package, which is compact and supports high-density designs.
6. Operating Temperature: The "I7" designation indicates an industrial temperature range, making it suitable for applications in harsh environments.
7. Low Power Consumption: Designed for low power applications, it supports efficient energy use without compromising performance.
8. Cost-Effectiveness: The Cyclone III family is known for being cost-effective, offering a balance between performance and price.
These features make it ideal for a variety of applications, including consumer electronics, industrial automation, and telecommunications.
1. Logic Elements: It contains 24,624 logic elements, suitable for implementing complex digital circuits.
2. Embedded Memory: The FPGA has 594 Kbits of embedded memory, providing storage for data and instructions.
3. I/O Pins: It offers 182 user I/O pins, providing flexibility for connecting with various peripherals and external devices.
4. Phase-Locked Loops (PLLs): There are 4 PLLs for clock management, useful in applications requiring precise timing and synchronization.
5. Package: It comes in a 256-pin FineLine BGA package, which is compact and supports high-density designs.
6. Operating Temperature: The "I7" designation indicates an industrial temperature range, making it suitable for applications in harsh environments.
7. Low Power Consumption: Designed for low power applications, it supports efficient energy use without compromising performance.
8. Cost-Effectiveness: The Cyclone III family is known for being cost-effective, offering a balance between performance and price.
These features make it ideal for a variety of applications, including consumer electronics, industrial automation, and telecommunications.
Pinout
The EP3C25F256I7 is an FPGA from the Altera Cyclone III family. It comes in a 256-pin FineLine BGA package. This FPGA offers a range of functionalities suitable for various applications, including digital signal processing, embedded processing, and bridging applications. It features 24,624 logic elements, 594 Kbits of embedded memory, and 66 embedded multipliers. Additionally, it supports a wide range of I/O standards, providing flexibility for interfacing with different types of peripherals and systems. Cyclone III FPGAs are known for their low power consumption and are typically used in cost-sensitive and high-volume applications.
Manufacturer
The EP3C25F256I7 is manufactured by Intel, under its Intel FPGA division, formerly known as Altera. Intel is a multinational corporation and technology company primarily known for designing and manufacturing semiconductor products, including processors, chipsets, and various types of integrated circuits. The company is a leader in the global semiconductor industry and is headquartered in Santa Clara, California.
This particular product, the EP3C25F256I7, is part of Intel's Cyclone III FPGA family. FPGAs, or Field-Programmable Gate Arrays, are integrated circuits that can be programmed by the customer or designer after manufacturing. They are used in a wide range of applications, from consumer electronics to telecommunications and industrial automation.
Intel's acquisition of Altera in 2015 allowed the company to expand its product offerings and bolster its capabilities in the programmable solutions sector, making Intel a significant player in the FPGA market. FPGAs are valued for their flexibility and adaptability, which are key in developing custom computing solutions and accelerating various computational tasks in industries such as data centers, automotive, and IoT (Internet of Things).
This particular product, the EP3C25F256I7, is part of Intel's Cyclone III FPGA family. FPGAs, or Field-Programmable Gate Arrays, are integrated circuits that can be programmed by the customer or designer after manufacturing. They are used in a wide range of applications, from consumer electronics to telecommunications and industrial automation.
Intel's acquisition of Altera in 2015 allowed the company to expand its product offerings and bolster its capabilities in the programmable solutions sector, making Intel a significant player in the FPGA market. FPGAs are valued for their flexibility and adaptability, which are key in developing custom computing solutions and accelerating various computational tasks in industries such as data centers, automotive, and IoT (Internet of Things).
Application
The EP3C25F256I7, a member of the Altera Cyclone III FPGA family, is used in various applications due to its low power consumption and high performance. Key application areas include:
1. Embedded Systems: Ideal for custom processing tasks and interfaces.
2. Communications: Used in protocol processing and networking equipment.
3. Industrial Automation: Suitable for control systems and robotics.
4. Consumer Electronics: Applied in signal processing and video processing.
5. Automotive: Used in infotainment systems and driver assistance features.
6. Medical Devices: Implemented in diagnostic and monitoring equipment.
These applications benefit from the FPGA’s flexible architecture and cost-effectiveness.
1. Embedded Systems: Ideal for custom processing tasks and interfaces.
2. Communications: Used in protocol processing and networking equipment.
3. Industrial Automation: Suitable for control systems and robotics.
4. Consumer Electronics: Applied in signal processing and video processing.
5. Automotive: Used in infotainment systems and driver assistance features.
6. Medical Devices: Implemented in diagnostic and monitoring equipment.
These applications benefit from the FPGA’s flexible architecture and cost-effectiveness.
Package
The package type for the EP3C25F256I7 is a FineLine BGA (Ball Grid Array) with 256 pins.