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EP3SL340F1517I3N
+BOMIC FPGA 976 I/O 1517FBGA
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Nhà sản xuấtIntel
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Ông. Phần #EP3SL340F1517I3N
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Bảng dữ liệu EP3SL340F1517I3N DataSheet
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Gói FBGA-1517
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Có sẵn4382
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package / Case | Tray |
| Series | Stratix® III L |
| Part Status | Obsolete |
| Number of LABs/CLBs | 13500 |
| Number of Logic Elements/Cells | 337500 |
| Total RAM Bits | 18822144 |
| Number of I/O | 976 |
| Voltage - Supply | 0.86V ~ 1.15V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Tổng quan
Description
- Family: Stratix III (FPGA)
- Logic Elements: 340K
- Package: 1517-pin FBGA (FineLine Ball Grid Array)
- Speed Grade: I3N (Industrial temperature range, -40°C to 100°C)
- Features: High-speed transceivers, DSP blocks, embedded memory, and low-power Programmable Power Technology
Designed for high-end applications like networking, signal processing, and military/aerospace, it balances performance and power efficiency.
Equivalent
- Xilinx Virtex-5 (XC5VLX330T)
- Lattice ECP5 (LFE5UM-85F)
- Microsemi (now Microchip) ProASIC3 (A3P1000)
These offer similar logic density and performance. For exact replacements, check pin compatibility and feature sets. Always verify with manufacturer datasheets.
Features
- Logic Elements: 340,000 LEs
- Memory: ~15.5 Mb embedded RAM
- DSP Blocks: 384 (18x18 multipliers)
- I/O Pins: 720 (supports LVDS, PCIe, DDR2/3)
- Transceivers: None (non-GX variant)
- Process Technology: 65 nm, low-power (1.0V core)
- Package: 1517-pin FineLine BGA (FBGA)
- Speed Grade: Industrial (-40°C to 100°C)
Designed for high-performance applications like signal processing and embedded systems.
Pinout
- Pin Count: 1517 pins (FBGA package)
- Functions:
- High-performance FPGA with 340K logic elements (LEs)
- Supports high-speed I/O (up to 1.6 Gbps LVDS)
- Embedded DSP blocks, memory blocks (M9K, M144K)
- Supports multiple I/O standards (LVDS, PCIe, DDR2/3)
- On-chip PLLs for clock management
- Configuration via JTAG, AS, or PS modes
This device is designed for high-speed digital processing, communications, and embedded applications.