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GD9FU2G8F3AMGI
+BOMIC FLASH 2GBIT ONFI
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Nhà sản xuấtGigaDevice Semiconductor (HK) Limited
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Ông. Phần #GD9FU2G8F3AMGI
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Series | GD9F |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | ONFI |
| Write Cycle Time - Word, Page | 20ns |
| Access Time | 18 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
Tổng quan
Description
GD9FU2G8F3AMGI appears to be a unique identifier or code, but without specific context, it's challenging to provide a precise introduction. It could relate to various fields such as technology, identification systems, product codes, or even a specific project or research initiative. If you can provide more details about its relevance or area of application, I would be able to give a more focused introduction. Please share any specific information or context regarding GD9FU2G8F3AMGI for a more accurate response.
Equivalent
The GD9FU2G8F3AMGI chip is a 2Gb NAND Flash memory device. Equivalent products include the Micron MT29F2G08ABAEAWP, Samsung K9GAG08U0M, and SK Hynix H26M21002M. Always verify compatibility based on specific application requirements and datasheet specifications.
Pinout
The GD9FU2G8F3AMGI is a 2GB NAND flash memory chip manufactured by GigaDevice. It typically features a 48-pin TSOP (Thin Small Outline Package) configuration. This chip is used for data storage in various applications, including smartphones, tablets, and other electronic devices.
The key functions of the pins include:
1. Data Pins (D0-D7): These pins are used for data input and output.
2. Address Pins (A0-A20): Address pins are used to select specific memory locations.
3. Control Pins: These include Chip Enable (CE#), Write Enable (WE#), and Read Enable (RE#) for controlling the read and write operations.
4. Power Supply Pins: Vcc for power and Vss for ground.
5. Status Pins: These may be used for indicating the status of operations or for additional functionalities.
Always refer to the specific datasheet for detailed electrical characteristics and pin functions.
The key functions of the pins include:
1. Data Pins (D0-D7): These pins are used for data input and output.
2. Address Pins (A0-A20): Address pins are used to select specific memory locations.
3. Control Pins: These include Chip Enable (CE#), Write Enable (WE#), and Read Enable (RE#) for controlling the read and write operations.
4. Power Supply Pins: Vcc for power and Vss for ground.
5. Status Pins: These may be used for indicating the status of operations or for additional functionalities.
Always refer to the specific datasheet for detailed electrical characteristics and pin functions.
Manufacturer
The GD9FU2G8F3AMGI is manufactured by GigaDevice Semiconductor Inc., a company that specializes in memory and storage solutions. Founded in 2005 and headquartered in Beijing, China, GigaDevice focuses on developing and providing a range of semiconductor products, including NAND flash memory, NOR flash memory, and microcontrollers.
GigaDevice is known for its commitment to innovation and quality in the semiconductor space, serving various industries such as consumer electronics, automotive, and industrial applications. The company's offerings are utilized in a wide variety of devices, from smartphones and tablets to IoT devices and automotive systems. As a prominent player in the semiconductor industry, GigaDevice continues to expand its product portfolio and market presence globally.
GigaDevice is known for its commitment to innovation and quality in the semiconductor space, serving various industries such as consumer electronics, automotive, and industrial applications. The company's offerings are utilized in a wide variety of devices, from smartphones and tablets to IoT devices and automotive systems. As a prominent player in the semiconductor industry, GigaDevice continues to expand its product portfolio and market presence globally.
Package
The GD9FU2G8F3AMGI is typically packaged in a thin, small outline package (TSOP) or similar form factor, designed for efficient space utilization in electronic devices. This package type is common for memory chips and integrates well into various circuit designs.
