HMC253ALC4

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HMC253ALC4

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IC RF SWITCH SP8T 3.5GHZ 24CQFN

  • Nhà sản xuấtCông ty Analog Devices Inc.

  • Ông. Phần #HMC253ALC4

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Thông số kỹ thuật

thuộc tính Giá trị
PartStatus Active
BaseProductNumber HMC253
RFType WiMax
Topology Absorptive
Circuit SP8T
FrequencyRange 0Hz ~ 3.5GHz
Isolation 43dB
InsertionLoss 1.1dB
TestFrequency 2GHz
P1dB 24dBm
IIP3 43dBm
Impedance 50Ohm
Voltage-Supply 5V
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package 24-TFCQFN Exposed Pad
SupplierDevicePackage 24-CQFN (4x4)
Packaging Strip

Tổng quan

Description

HMC253ALC4 is a microwave MMIC device from Hittite Microwave (now Analog Devices). It’s a 50-ohm matched RF IC in the ALC4 ceramic package. The HMC253 family covers various front-end RF blocks (amplifiers, mixers, or switches); the exact function of the HMC253ALC4 depends on the die inside—so check the datasheet to confirm whether this variant is an LNA, mixer, or switch. Typical use is as a RF front-end block in wireless, aerospace/defense, or test equipment, often requiring external matching networks and a bias supply. Key specs to verify in the datasheet include the frequency range, gain or conversion loss, noise figure, IIP3/OP3, bias pins, and package/pinout. The datasheet also provides recommended operating conditions and an evaluation board. If you’re after a precise description, the exact datasheet and application note for HMC253ALC4 are the best sources.

Pinout

Pin count: 4 pins.
Function: HMC253ALC4 is a GaAs MMIC RF amplifier in a 4-pin package. It provides single-ended RF amplification with a DC bias pin. Typical pinout (approximate): RF input, RF output, Vcc (DC bias), and Ground.

Manufacturer

- Manufacturer: Analog Devices, Inc. (ADI). The HMC253ALC4 is in the line that originated with Hittite Microwave, which ADI acquired in 2014.
- Company type: A global semiconductor company that designs and manufactures analog, mixed-signal, and digital signal processing ICs, including RF/microwave components.

Application

HMC253ALC4 is a GaAs MMIC mixer used in RF/microwave front-ends. Common application areas include:
- Wireless transceivers and receivers (downconverter/upconverter)
- Satellite/VSAT front-ends and microwave point-to-point links
- Radar and automotive radar sensor subsystems
- Military/Aerospace RF/microwave system front-ends
- Test & measurement equipment (mixing stages in VNAs, spectrum analyzers, signal generators)
- Prototyping and production where compact, high-performance RF mixers are needed
In short: any RF/microwave path requiring mixing (RF↔IF) in both transmit and receive chains.

Package

Leadless Ceramic Chip Carrier (LCC) package for surface-mount.

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