ICM-20649

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ICM-20649

+BOM

WIDE-FULL SCALE RANGE 6-AXIS MEM

  • Nhà sản xuấtTDK InvenSense

  • Ông. Phần #ICM-20649

  • Có sẵn7795

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Thông số kỹ thuật

thuộc tính Giá trị
Part Status Obsolete
Sensor Type Accelerometer, Gyroscope, Temperature, 6 Axis
Output Type I2C, SPI
Operating Temperature -40°C ~ 85°C
Package 24-VFQFN Module Exposed Pad
Supplier Device Package 24-QFN (3x3)
Mounting Type Surface Mount
Packaging Cut Tape (CT), Tape & Reel (TR)

Tổng quan

Description

The ICM-20649 is a high-performance Inertial Measurement Unit (IMU) developed by InvenSense, a subsidiary of TDK. This device integrates a 6-axis motion tracking solution, which includes a 3-axis gyroscope and a 3-axis accelerometer, in a compact package. It's designed for a wide range of applications, including augmented reality, virtual reality, drones, robotics, and wearable devices, where precise motion sensing is crucial.
One of the key features of the ICM-20649 is its high-resolution sensors that offer extended measurement ranges—up to ±4000 degrees per second for the gyroscope and ±30g for the accelerometer. This makes it suitable for high dynamic range applications. The device also includes a Digital Motion Processor (DMP), which offloads computation from the host processor, reducing system power consumption.
The ICM-20649 supports multiple interfaces, including I²C and SPI, facilitating easy integration into various systems. Its low power consumption and small form factor make it ideal for portable and battery-powered applications.

Equivalent

The ICM-20649 is a 6-axis motion sensor from TDK InvenSense featuring a 3-axis gyroscope and a 3-axis accelerometer. Equivalent products include the Bosch BMI160 STMicroelectronics LSM6DS3, and NXP's FXOS8700CQ. These chips offer similar functionalities for motion sensing in various applications. Always verify specifications to ensure compatibility with your specific requirements.

Features

The ICM-20649 is a high-performance 6-axis MEMS motion tracking device that features a 3-axis gyroscope and a 3-axis accelerometer. Key features include:
1. High Precision: It offers a wide range of motion sensing capabilities with a 30g accelerometer and a 4000 degrees per second (dps) gyroscope, suitable for high-dynamic applications.
2. DMP Support: Integrated Digital Motion Processor (DMP) for on-chip sensor fusion.
3. Low Power Consumption: Designed for battery-powered devices with configurable power modes to optimize energy use.
4. Low Noise: Provides low noise measurements for both the accelerometer and gyroscope, enhancing performance accuracy.
5. FIFO Buffer: Includes a 4096-byte FIFO buffer to minimize host processor intervention.
6. I2C and SPI Interfaces: Supports both I2C and SPI interfaces for flexible communication with a host processor.
7. Temperature Sensor: An embedded temperature sensor offers thermal compensation and additional environmental monitoring.
8. Compact Package: Available in a small form factor (3x3x0.9 mm LGA package), making it suitable for compact devices.
9. Industry Applications: Widely used in consumer electronics, drones, robotics, and fitness devices.

Pinout

The ICM-20649 is a high-performance 6-axis MotionTracking device that includes a 3-axis gyroscope and a 3-axis accelerometer. It is commonly used in applications requiring precise motion sensing, such as smartphones, wearables, and other consumer electronics.
The ICM-20649 comes in a 3 mm x 3 mm x 0.9 mm 14-pin LGA package. Here is a brief overview of its pin functions:
1. VDD - Power supply for the device.
2. VDDIO - Power supply for the I/O interface.
3. GND - Ground.
4. FSYNC - Frame synchronization digital input.
5. INT - Interrupt digital output.
6. SCL - I²C serial clock line or SPI serial clock.
7. SDA/SDI - I²C serial data line or SPI serial data input.
8. SDO - SPI serial data output (can also be used as I²C address select).
9. RESV (x5) - Reserved pins, should be left unconnected or connected as per datasheet instructions.
10. nCS - Chip select for SPI (active low).
These pins provide the necessary interface for communication and operation, supporting both I²C and SPI protocols. Always refer to the specific datasheet for detailed connection and configuration guidelines.

Manufacturer

The ICM-20649 is manufactured by TDK InvenSense. TDK InvenSense is a subsidiary of TDK Corporation, which is a multinational electronics company headquartered in Japan. TDK InvenSense specializes in developing and manufacturing micro-electromechanical systems (MEMS) sensors and solutions. These sensors are used in various applications, including consumer electronics, automotive, industrial, and Internet of Things (IoT) devices. The ICM-20649 is an inertial measurement unit (IMU) that features a 6-axis sensor, combining a 3-axis gyroscope and a 3-axis accelerometer, commonly used for motion tracking in various devices.

Application

The ICM-20649 is a versatile 6-axis motion sensor combining a 3-axis gyroscope and a 3-axis accelerometer. Its primary application areas include smartphones and tablets for motion tracking and gesture recognition, wearable devices for fitness and health monitoring, and drones for stabilization and navigation. It is also used in virtual and augmented reality systems to enhance user interaction, in robotics for precise motion control, and in automotive systems for dynamic stability control and navigation. Additionally, its high performance makes it suitable for industrial applications requiring accurate motion sensing, such as machinery monitoring and control systems.

Package

The ICM-20649 is packaged in a 3 mm x 3 mm x 0.9 mm LGA (Land Grid Array) package.

Frequently Asked Questions


Q: Is the ICM-20649 an obsolete part, and can it still be used in new designs?
A: Yes, its status is Obsolete. It is not recommended for new designs; consider using the manufacturer's newer generation 6-axis IMU.


Q: What communication interfaces does this 6-axis sensor support?
A: It supports both I2C and SPI digital output interfaces for flexible host processor integration.


Q: What is the operating temperature range of the ICM-20649?
A: It operates from -40°C to +85°C, making it suitable for industrial and consumer temperature environments.


Q: What is the package type and size of this IMU?
A: It comes in a 24-VFQFN Exposed Pad module, with a supplier package size of 24-QFN (3x3 mm).


Q: Does this component integrate temperature sensing?
A: Yes, it integrates temperature, accelerometer, and gyroscope sensing in a single 6-axis device.


Q: What mounting method is required for this QFN module?
A: It is designed for Surface Mount (SMD) technology, compatible with standard reflow soldering processes.


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