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ICND2153AP
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Nhà sản xuấtChipone Tech
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Ông. Phần #ICND2153AP
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Có sẵn28522
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Manufacturer | Chipone Tech |
| Package / Case | SSOP24 |
Tổng quan
Equivalent
The ICND2153AP is a PWM controller IC. Equivalent or similar products include:
- UC3843 (Texas Instruments)
- SG3843 (ON Semiconductor/STMicroelectronics)
- KA3843 (Fairchild/ON Semi)
- TL3843 (Texas Instruments)
These are drop-in replacements with comparable functionality for power supply applications. Verify pin compatibility and electrical specs before substitution.
- UC3843 (Texas Instruments)
- SG3843 (ON Semiconductor/STMicroelectronics)
- KA3843 (Fairchild/ON Semi)
- TL3843 (Texas Instruments)
These are drop-in replacements with comparable functionality for power supply applications. Verify pin compatibility and electrical specs before substitution.
Pinout
The ICND2153AP is a 16-pin IC primarily used as a dual-channel MOSFET driver. Key functions include:
- Pin Count: 16 pins (SOIC package)
- Function: Provides high-current gate drive for two N-channel MOSFETs, commonly used in synchronous buck converters.
- Features:
- Independent input controls for each channel
- Bootstrap diode for high-side drive
- Under-voltage lockout (UVLO) protection
- Fast switching capability
Typical applications include DC-DC converters and motor drives. For exact pinout details, refer to the datasheet.
- Pin Count: 16 pins (SOIC package)
- Function: Provides high-current gate drive for two N-channel MOSFETs, commonly used in synchronous buck converters.
- Features:
- Independent input controls for each channel
- Bootstrap diode for high-side drive
- Under-voltage lockout (UVLO) protection
- Fast switching capability
Typical applications include DC-DC converters and motor drives. For exact pinout details, refer to the datasheet.
Package
The ICND2153AP is a power management IC (PMIC) typically available in a DFN (Dual Flat No-leads) package, such as DFN-8 or similar small outline variants. These packages are compact, surface-mount types with exposed pads for thermal dissipation, suitable for space-constrained applications. Exact dimensions (e.g., 3x3mm) vary; refer to the datasheet for specifics.
