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IS45S16320F-7BLA2
+BOMIC DRAM 512MBIT PAR 54TFBGA
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Nhà sản xuấtISSI, Integrated Silicon Solution Inc
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Ông. Phần #IS45S16320F-7BLA2
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Có sẵn4649
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM |
| Memory Size | 512Mbit |
| Memory Organization | 32M x 16 |
| Memory Interface | Parallel |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 54-TFBGA |
| Supplier Device Package | 54-TW-BGA (8x13) |
| Base Product Number | IS45S16320 |
| Clock Frequency | 143 MHz |
| Access Time | 5.4 ns |
Tổng quan
Description
Key features include a burst length of 1, 2, 4, 8, or full-page for flexible data transfer, CAS latency options of 2 and 3, and auto-refresh and self-refresh modes that enhance power efficiency and maintain data integrity. The IS45S16320F-7BLA2 is suitable for a wide range of applications, including consumer electronics, telecommunications, and embedded systems, where reliable and speedy memory solutions are essential. Its compact TSOP-II (Thin Small Outline Package) form factor ensures easy integration into various circuit designs.
Equivalent
1. Micron MT48LC16M16A2 - 16Mb SDRAM
2. Samsung K4S161622H - 16Mb SDRAM
3. Hynix HY57V161610FTP - 16Mb SDRAM
Ensure compatibility by verifying specifications such as speed, voltage, and package type before selection.
Features
1. Density and Organization: It has a 512Mb density configured as 32M x 16 bits.
2. Clock Speed: Operates at a clock frequency with a 7 ns cycle time, supporting up to 143 MHz clock speed.
3. Interface: Features a synchronous interface with a double data rate, meaning data is transferred on both the rising and falling edges of the clock signal.
4. Voltage: Operates with a power supply voltage range typically around 3.3V.
5. Burst Length: Supports burst lengths of 1, 2, 4, 8, or full page for flexible data read/write operations.
6. CAS Latency: Offers configurable CAS latency options to optimize performance.
7. Temperature Range: Suitable for industrial applications with a broad operating temperature range.
8. Package Type: Available in a compact, lead-free BGA package for efficient space utilization.
Overall, it is designed for applications needing reliable and high-speed memory solutions.
Pinout
The package typically used for this component is a 54-pin TSOP II (Thin Small Outline Package), which is common for SDRAM chips. The pins serve a variety of functions essential for the operation of the SDRAM, including:
- Data Pins (DQ): 16 pins for data input/output.
- Address Pins (A0-A12): Used to specify the memory address for read/write operations.
- Control Pins: Including CS (Chip Select), RAS (Row Address Strobe), CAS (Column Address Strobe), and WE (Write Enable) for controlling the operation of the SDRAM.
- Clock (CLK): Synchronizes the memory operations.
- Power Pins: VDD and VSS for power supply and ground, respectively.
- DQM (Data Mask): Used to mask write operations.
- Bank Address Pins (BA0, BA1): Used to select the memory bank within the SDRAM.
This concise description outlines the primary pin functions without delving into the detailed operational behavior of the SDRAM.
Manufacturer
Application
1. Consumer Electronics: Utilized in devices like digital cameras, set-top boxes, and smart TVs for efficient data processing and storage.
2. Networking Equipment: Applied in routers and switches for buffering and caching data.
3. Industrial Automation: Supports data handling in PLCs (Programmable Logic Controllers) and automated control systems.
4. Telecommunications: Used in base stations and other telecom infrastructure for managing large volumes of data.
5. Embedded Systems: Provides memory support for various microcontroller-based systems requiring high-speed data access.