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K4B1G1646G-BCK0
+BOM-
Nhà sản xuấtSamsung
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Ông. Phần #K4B1G1646G-BCK0
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Manufacturer | Samsung |
| Package | BGA96-7.5x13.3-0.8mm |
Tổng quan
Description
Manufactured by Samsung, this chip has a density of 1Gb (Gigabit), organized in 64M x 16 configurations. It's designed for a variety of applications, including computing, networking, and consumer electronics, where efficient data processing is critical. The BCK0 in its designation typically refers to the specific speed bin and package type, affecting the chip’s operating frequency and power requirements.
This memory chip operates at a voltage of 1.5V and supports a data transfer rate of 1600 MT/s (megatransfers per second). The compact form factor and high efficiency make it suitable for devices requiring robust performance with minimal power usage, contributing to faster processing speeds and enhanced system responsiveness.
Equivalent
1. Hynix H5TQ1G63BFR – 1Gb DDR3 SDRAM.
2. Micron MT41J64M16 – 1Gb DDR3 SDRAM.
3. Nanya NT5CB128M16 – 1Gb DDR3 SDRAM.
4. Elpida EDJ2116CBBG – 1Gb DDR3 SDRAM.
These chips share similar specifications, such as density, speed, and voltage, making them suitable alternatives.
Features
1. Capacity: 1 Gigabit (Gb).
2. Technology: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory).
3. Data Width: x16 configuration.
4. Voltage: Operates at a low voltage of 1.5V, which helps in reducing power consumption.
5. Speed: Capable of operating at high speeds, typically 1333 Mbps (megabits per second).
6. Package Type: Available in FBGA (Fine-pitch Ball Grid Array) package, which is common for modern DRAM chips.
7. Temperature Range: Designed to operate within a standard temperature range suitable for most electronic devices.
These features make the K4B1G1646G-BCK0 suitable for various applications that require efficient memory performance with low power consumption.
Pinout
Manufacturer
Application
1. Consumer Electronics: Used in devices like smart TVs, set-top boxes, and gaming consoles.
2. Computing: Integrated into desktops, laptops, and workstations for improved performance.
3. Networking: Utilized in routers, switches, and other networking equipment.
4. Industrial Systems: Employed in control systems and monitoring devices.
5. Mobile Devices: Occasionally found in smartphones and tablets needing DDR3 RAM.
These applications benefit from the chip's ability to deliver high bandwidth and low latency.
Package
Frequently Asked Questions
Q: What is the specific package type and dimensions for the K4B1G1646G-BCK0?
A: It comes in a BGA96 package with dimensions of 7.5mm x 13.3mm and a 0.8mm ball pitch, suitable for high-density PCB layouts.
Q: Is this component a DDR3 or DDR4 SDRAM?
A: Based on the Samsung part number prefix K4B1G, this is a 1Gb DDR3 SDRAM, commonly used in computing and networking applications.
Q: What is the typical operating voltage for this memory chip?
A: DDR3 SDRAMs like this typically operate at 1.5V core and I/O voltage, with optional 1.35V low-voltage support if specified.
Q: Can this component be used for industrial temperature range applications?
A: The standard K4B1G1646G-BCK0 is often rated for commercial temperature (0°C to 85°C); confirm the specific temperature grade from Samsung datasheets.
Q: What is the data bus width configuration for this part?
A: The "16" in the part number indicates a x16 (16-bit) data bus width, making it ideal for embedded systems and small form-factor designs.
Q: Is this component RoHS compliant and lead-free?
A: The "-BCK0" suffix typically indicates a lead-free and Halogen-free package, but please verify with the manufacturer if RoHS certification is listed.