Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package / Case | Tray |
| Series | ECP2M |
| Part Status | Active |
| Number of LABs/CLBs | 2375 |
| Number of Logic Elements/Cells | 19000 |
| Total RAM Bits | 1246208 |
| Number of I/O | 140 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Tổng quan
Description
LFE2M20SE-5FN256C is a Lattice MachXO2 non-volatile FPGA (LFE2 family). It packs about 20K logic elements into a compact 256‑pin FineLine BGA (FN256C) and uses the -5 speed grade. The device stores its configuration in on‑chip flash, enabling instant-on operation with no external configuration memory.
Key points:
- Non-volatile, flash-based FPGA for simple glue logic and small control/bridge tasks
- ~20K LEs in a 256-pin package; multiple I/O banks with various voltage standards
- Low power, suitable for cost- and space-constrained designs
- Programmable logic with embedded RAM blocks and basic clocking resources
Typical uses:
- Glue logic, small state machines, interface bridging, microcontroller peripherals
- Applications needing instant-on, compact footprints and easy field updates
Design flow and programming:
- Tooling: Lattice Diamond for synthesis/place-and-route; programming via SPI/JTAG per package
- Refer to the MachXO2 M20SE datasheet and product page for exact I/O counts, RAM capacity, timing, and electrical specs.
Key points:
- Non-volatile, flash-based FPGA for simple glue logic and small control/bridge tasks
- ~20K LEs in a 256-pin package; multiple I/O banks with various voltage standards
- Low power, suitable for cost- and space-constrained designs
- Programmable logic with embedded RAM blocks and basic clocking resources
Typical uses:
- Glue logic, small state machines, interface bridging, microcontroller peripherals
- Applications needing instant-on, compact footprints and easy field updates
Design flow and programming:
- Tooling: Lattice Diamond for synthesis/place-and-route; programming via SPI/JTAG per package
- Refer to the MachXO2 M20SE datasheet and product page for exact I/O counts, RAM capacity, timing, and electrical specs.
Features
LFE2M20SE-5FN256C features (concise):
- 20K logic elements (LEs)
- 256-pin FineLine BGA package (FN256C)
- Speed grade -5
- 3.3V-tolerant I/O banks with 1.2V core
- High I/O density within 256-pin package (hundreds of I/Os)
- On-chip memory: distributed RAM and block RAM
- Clock management with PLLs for multiple clock domains
- Configuration: JTAG and Active Serial; SPI flash option
- Low power, compact cost-sensitive device
- Suitable for small-to-mid range FPGA tasks, DSP and glue logic
- 20K logic elements (LEs)
- 256-pin FineLine BGA package (FN256C)
- Speed grade -5
- 3.3V-tolerant I/O banks with 1.2V core
- High I/O density within 256-pin package (hundreds of I/Os)
- On-chip memory: distributed RAM and block RAM
- Clock management with PLLs for multiple clock domains
- Configuration: JTAG and Active Serial; SPI flash option
- Low power, compact cost-sensitive device
- Suitable for small-to-mid range FPGA tasks, DSP and glue logic
Pinout
- Pin count: 256 pins
- Function: Lattice MachXO2 LFE2M20SE device – a 256-pin FineLine BGA programmable logic device (FPGA/PLD) used for glue logic and small digital designs.
- Function: Lattice MachXO2 LFE2M20SE device – a 256-pin FineLine BGA programmable logic device (FPGA/PLD) used for glue logic and small digital designs.
Manufacturer
Lattice Semiconductor. It is a fabless semiconductor company that designs and markets programmable logic devices, such as FPGAs and CPLDs, for embedded and consumer electronics.
Application
LFE2M20SE-5FN256C is a mid-density Lattice FPGA (ECP2M family) suitable for cost-sensitive, high-volume designs. Common application areas include:
- Telecommunications and data communications (packet processing, line/protocol interfaces)
- Video, imaging and multimedia processing (HD/SD pipelines, camera interfaces)
- Industrial automation and control (motor control, I/O bridging, PLC-like logic)
- Automotive electronics (body/infotainment subsystems, sensor interfaces)
- Consumer electronics (set-top boxes, display controllers, DSP tasks)
- Test, measurement and instrumentation (data acquisition, signal conditioning)
- FPGA-based prototyping and education/research
It provides moderate logic, memory, DSP resources and IO with low power in a 256-pin package.
- Telecommunications and data communications (packet processing, line/protocol interfaces)
- Video, imaging and multimedia processing (HD/SD pipelines, camera interfaces)
- Industrial automation and control (motor control, I/O bridging, PLC-like logic)
- Automotive electronics (body/infotainment subsystems, sensor interfaces)
- Consumer electronics (set-top boxes, display controllers, DSP tasks)
- Test, measurement and instrumentation (data acquisition, signal conditioning)
- FPGA-based prototyping and education/research
It provides moderate logic, memory, DSP resources and IO with low power in a 256-pin package.
Package
FineLine BGA package, 256-ball (FN256C).
