MCF5373LCVM240

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MCF5373LCVM240

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IC MCU 32BIT ROMLESS 196MAPBGA

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Thông số kỹ thuật

thuộc tính Giá trị
Package Tray
Series MCF537x
ProductStatus Not For New Designs
CoreProcessor Coldfire V3
CoreSize 32-Bit Single-Core
Speed 240MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals DMA, POR, PWM, WDT
NumberofI/O 62
ProgramMemoryType ROMless
RAMSize 32K x 8
Voltage-Supply(Vcc/Vdd) 1.4V ~ 3.6V
OscillatorType External
OperatingTemperature -40°C ~ 85°C (TA)
MountingType Surface Mount
Package/Case 196-LBGA

Tổng quan

Description

The MCF5373LCVM240 is a microcontroller unit within the ColdFire family, produced by NXP Semiconductors. It is designed for embedded control applications and offers a blend of performance, integration, and cost-effectiveness. The MCF5373L operates with a maximum clock speed of 240 MHz, providing robust processing power for a variety of tasks.
Key features include an integrated Fast Ethernet Controller for network connectivity, several Universal Asynchronous Receiver/Transmitters (UARTs), and an Inter-Integrated Circuit (I2C) bus interface for communication with peripheral devices. It also includes a Direct Memory Access (DMA) controller for efficient data handling and a variety of timers and Pulse Width Modulation (PWM) channels for managing real-time control tasks.
The microcontroller supports numerous interfaces, including Serial Peripheral Interface (SPI), making it versatile for different applications. It offers up to 512 KB of Flash memory and 64 KB of SRAM, enabling ample storage and memory for embedded systems. The MCF5373LCVM240 is ideal for industrial control, automotive, and consumer electronics applications that require a balance of performance and integration.

Equivalent

The MCF5373LCVM240 is a ColdFire microprocessor from NXP. Equivalent products typically include other ColdFire processors in the same family or those with similar specifications. Equivalent options might include chips from the MCF537x series, such as the MCF5372 or MCF5371, depending on specific requirements like clock speed and peripheral set. It's advisable to confirm compatibility based on your exact application needs, power requirements, and feature sets. Always consult the manufacturer's datasheets for precise comparisons.

Features

The MCF5373LCVM240 is a ColdFire microcontroller from NXP Semiconductors, designed for embedded applications. It features a 32-bit ColdFire V3 core operating at up to 240 MHz, offering a balance of performance and power efficiency. The microcontroller includes multiple connectivity options, such as Ethernet, USB, and CAN interfaces, making it suitable for networked and industrial applications. Additionally, it supports a variety of serial communication protocols, including UART, I2C, and SPI. The MCF5373LCVM240 is equipped with a flexible memory architecture, featuring on-chip Flash memory and SRAM for storage and execution of code and data. It also includes advanced security features for secure data handling and software protection. The microcontroller is designed for real-time applications, with a range of timers and pulse width modulation (PWM) modules to manage precise timing tasks. Its low power modes and efficient design make it suitable for power-sensitive applications. The package typically comes in a compact and durable LQFP form factor, suitable for various environmental conditions.

Pinout

The MCF5373LCVM240 is a microprocessor from Freescale Semiconductor (now part of NXP Semiconductors). It is part of the MCF537x series, which is based on the ColdFire V3 core. The MCF5373LCVM240 comes with a pin count of 256, housed in a MAPBGA (Metric Ball Grid Array) package.
This microprocessor is designed for embedded applications and offers various functionalities, including:
- 32-bit ColdFire V3 Core: Provides high performance suitable for a range of embedded applications.
- Peripheral Features: Includes a variety of integrated peripherals such as UARTs, I2C, QSPI, and timers.
- Networking Capabilities: Features Ethernet support, making it suitable for network-enabled applications.
- Memory Management: Support for external memory interfaces, including SDRAM, Flash, and SRAM.
- Integrated Security: May include some security features for embedded applications, though specifics depend on the series variant.
The MCF5373LCVM240 is suitable for industrial control, networking, and other embedded systems applications that require efficient processing and peripheral integration.

Manufacturer

The MCF5373LCVM240 is manufactured by NXP Semiconductors. NXP is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in designing and manufacturing a wide range of semiconductor products, including microcontrollers, processors, and integrated circuits, for various applications across automotive, industrial, and consumer markets. NXP is known for its focus on creating secure connectivity solutions and plays a significant role in the advancement of the Internet of Things (IoT) and smart technologies. The company was originally a part of Philips Electronics, from which it was spun off in 2006. NXP has since grown into one of the leading players in the semiconductor industry, known for its innovative solutions and extensive portfolio of products.

Application

The MCF5373LCVM240 is a ColdFire microprocessor by NXP, designed for embedded applications. It is commonly used in areas such as industrial automation, consumer electronics, networking equipment, and security systems. Its processing capabilities and integrated peripherals make it suitable for control systems, human-machine interfaces, and data communication devices. Additionally, the microprocessor is often utilized in applications requiring Ethernet connectivity and where efficient real-time processing is critical. Its compact design and low power consumption also make it ideal for portable and space-constrained devices.

Package

The MCF5373LCVM240 is a microcontroller from NXP's ColdFire family. It comes in a 196-pin MAPBGA (Molded Array Plastic Ball Grid Array) package, which is a compact, high-density packaging type well-suited for applications requiring high performance and low power consumption.

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