MP2888AGU

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MP2888AGU

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  • Nhà sản xuấtMonolithic Power Systems

  • Ông. Phần #MP2888AGU

  • Có sẵn19634

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Thông số kỹ thuật

thuộc tính Giá trị
Manufacturer Monolithic Power Systems
Package QFN-40 (5mmx5mm)

Tổng quan

Description

The MP2888AGU is a high-efficiency, synchronous, step-down DC-DC converter from Monolithic Power Systems (MPS).
### Key Features:
- Input Voltage: 4.5V to 18V
- Output Current: Up to 8A
- Switching Frequency: 300kHz to 2.2MHz (adjustable)
- Efficiency: Up to 95%
- Protections: Over-current (OCP), over-voltage (OVP), thermal shutdown
### Applications:
- Servers, networking equipment
- FPGAs, ASICs, GPUs
- Industrial and automotive systems
### Advantages:
- Compact solution with integrated MOSFETs
- Adjustable soft-start & frequency synchronization
- Low standby current for power-saving modes
The MP2888AGU is ideal for high-performance power delivery in space-constrained designs.

Equivalent

The MP2888AGU is a high-efficiency, synchronous step-down converter. Equivalent or similar products include:
- MP2307 (Monolithic Power Systems)
- LM2675 (Texas Instruments)
- AP3406 (Diodes Incorporated)
- RT8259 (Richtek)
These alternatives offer comparable step-down DC-DC conversion with similar voltage and current ratings. Always verify datasheets for exact compatibility.

Manufacturer

The MP2888AGU is a power management IC (PMIC) manufactured by Monolithic Power Systems (MPS).
MPS is a leading semiconductor company specializing in high-performance power solutions for computing, automotive, industrial, and consumer applications. Known for innovation in power efficiency and compact designs, MPS provides integrated circuits (ICs) that optimize energy usage in electronic devices. The company is headquartered in the U.S. (San Jose, California) and operates globally.
The MP2888AGU is typically used in voltage regulation for GPUs, CPUs, and other high-performance systems. MPS is recognized for its reliable, high-efficiency power management products.

Package

The MP2888AGU is a QFN (Quad Flat No-leads) package type. It features a compact, surface-mount design with exposed pads for thermal and electrical performance. The specific variant is likely QFN-xx (exact pin count may vary). This package is common for power management ICs, offering efficient heat dissipation and space-saving benefits.

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