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MR25H10CDF
+BOMIC RAM 1MBIT SPI 40MHZ 8DFN
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Nhà sản xuấtEverspin Technologies Inc.
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Ông. Phần #MR25H10CDF
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Bảng dữ liệu MR25H10CDF DataSheet
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Gói DFN-8
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Có sẵn6050
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package / Case | Tray |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | RAM |
| Technology | MRAM (Magnetoresistive RAM) |
| Memory Size | 1Mb (128K x 8) |
| Memory Interface | SPI |
| Clock Frequency | 40 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Tổng quan
Description
The MR25H10CDF has a storage capacity of 1 Megabit (128 Kilobytes) and is organized in a serial SPI (Serial Peripheral Interface) format, which supports high-speed serial communication. It operates within a wide temperature range, making it suitable for industrial applications, and offers data retention for over 20 years with virtually unlimited read/write endurance.
This chip is commonly used in applications where reliable data storage is crucial, such as in automotive systems, industrial controls, and mission-critical computing environments. Its robust performance and energy efficiency make it a preferred choice for systems requiring persistent memory with rapid data access times.
Equivalent
Features
1. High Speed: MRAM offers fast read and write speeds comparable to SRAM, allowing for quick data access and storage.
2. Non-Volatile: Unlike traditional RAM, MRAM retains data even when the power is turned off.
3. Endurance: The device supports virtually unlimited read/write cycles, making it highly durable for applications requiring frequent data access.
4. Density and Capacity: The MR25H10CDF typically provides a storage capacity of 1 Megabit.
5. Low Power Consumption: Consumes significantly less power compared to other non-volatile memory types, making it suitable for battery-powered applications.
6. Wide Temperature Range: Operates effectively across a broad temperature range, enhancing reliability in various environmental conditions.
7. Serial Peripheral Interface (SPI): Uses a simple SPI protocol for communication, which simplifies integration into existing systems.
8. Compact Package: The device is available in a space-efficient DFN package (Dual Flat No-leads), which is suitable for compact designs.
These features make the MR25H10CDF suitable for a wide range of applications, including automotive, industrial, and consumer electronics.
Pinout
1. CS (Chip Select): Activates the device when low.
2. SO (Serial Output): Outputs data from the device.
3. WP (Write Protect): Disables all write operations to the memory if low.
4. VSS (Ground): Ground reference for the device.
5. SI (Serial Input): Inputs data into the device.
6. SCK (Serial Clock): Provides the clock for SPI operations.
7. HOLD: Pauses communication while maintaining the current operation.
8. VCC: Power supply for the device.
These pins facilitate the MRAM's SPI (Serial Peripheral Interface) operation, allowing communication with a microcontroller or other digital systems. The MR25H10CDF is known for its non-volatility, high speed, and endurance in data storage applications.