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MT29F2G08ABAEAWP:E
+BOMIC FLASH 2GBIT PARALLEL 48TSOP I
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Nhà sản xuấtMicron Technology Inc.
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Ông. Phần #MT29F2G08ABAEAWP:E
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Có sẵn6037
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Part Status | Last Time Buy |
| Base Product Number | MT29F2G08 |
| DigiKey Programmable | Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 2Gbit |
| Memory Organization | 256M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 48-TFSOP (0.724", 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
| Packaging | Tray |
Tổng quan
Description
The chip operates with a 3.3V power supply and features an 8-bit I/O interface, facilitating efficient data transfer. It supports common NAND Flash operations such as program, erase, and read cycles, and features advanced error correction capabilities to ensure data accuracy. Its compact design is ideal for embedded systems and consumer electronics where space is a premium.
The MT29F2G08ABAEAWP:E is typically used in devices requiring robust storage solutions, such as industrial equipment, automotive systems, and various consumer electronic products. Its high endurance and reliability make it a popular choice for applications that require frequent data writing and erasing.
Equivalent
1. Samsung: K9F2G08U0C
2. Toshiba/Kioxia: TC58NVG2S3ETA00
3. SK Hynix: H27U2G8F2BTR-BC
4. Winbond: W29N02GVSIAA
These chips offer similar NAND Flash capabilities and are commonly used in storage applications. Always check datasheets for specific compatibility requirements.
Features
1. Capacity: 2 Gb (Gigabit) storage capacity.
2. Interface: SLC (Single-Level Cell) NAND, which is faster and more durable than multi-level cell variants.
3. Page Size: 4,296 bytes (4,096 + 200 bytes for spare area).
4. Block Size: Composed of 64 pages, which amounts to 256 KB per block.
5. Voltage: Operates at 3.3V for both core and I/O.
6. Performance: Fast read and write operations, suitable for high-speed applications.
7. Endurance: Higher endurance due to SLC architecture, supporting more program/erase cycles compared to MLC NAND.
8. Operating Temperature: Range from -40°C to +85°C, suitable for industrial applications.
9. Package: Available in a TSOP (Thin Small Outline Package) for compact applications.
10. Data Retention: Reliable data retention capabilities.
These features make it suitable for various applications, including consumer electronics, industrial, and automotive systems, where reliability and speed are critical.
Pinout
The primary functions of these pins include:
- I/O pins (I/O0-I/O7): Used for data input and output.
- CLE (Command Latch Enable): Activates command input.
- ALE (Address Latch Enable): Activates address input.
- CE# (Chip Enable): Enables the chip for operation.
- WE# (Write Enable): Controls data write into the chip.
- RE# (Read Enable): Controls data read from the chip.
- WP# (Write Protect): Protects the memory from being modified.
- R/B# (Ready/Busy): Indicates the chip's status.
- VCC: Power supply pin.
- VSS: Ground pin.
These pins function together to manage data storage and retrieval processes within the NAND Flash memory.
Manufacturer
Application
1. Consumer Electronics: Used in devices such as smartphones, tablets, and digital cameras for data storage.
2. Computing: Utilized in solid-state drives (SSDs) and other storage devices in laptops and desktops.
3. Embedded Systems: Serves as storage in embedded applications for automotive, industrial, and IoT devices.
4. Networking: Employed in routers and switches for configuration and data storage.
5. Gaming: Used in gaming consoles for storage of games and user data.
Its high storage capacity and reliability make it suitable for data-intensive applications.
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the MT29F2G08ABAEAWP:E?
A: It is a 2Gbit NAND Flash memory organized as 256M x 8 bits, providing 256MB of non-volatile storage.
Q: What is the supply voltage range for this device?
A: The operating voltage range is 2.7V to 3.6V, suitable for standard 3.3V system designs.
Q: Is this NAND Flash compatible with a parallel interface?
A: Yes, it uses a parallel memory interface, ideal for direct connection to legacy or high-throughput controllers.
Q: What is the operating temperature range of this component?
A: It operates from 0°C to 70°C (TA), making it suitable for commercial-grade applications.
Q: What package options are available for this part?
A: It comes in a 48-TFSOP (0.724", 18.40mm Width) package with a supplier device package of 48-TSOP I, surface mount.
Q: Is this part currently in production or nearing end-of-life?
A: Its Part Status is "Last Time Buy," indicating it is near end-of-life; plan for last-time purchases accordingly.
Q: Can this memory be used for code storage or data logging in embedded systems?
A: Yes, as a NAND Flash, it is ideal for high-density data storage in embedded systems, but not for direct code execution (XIP).