Hình ảnh chỉ để tham khảo
MT47H32M16NF-25E:H
+BOMIC DRAM 512MBIT PARALLEL 84FBGA
-
Nhà sản xuấtMicron Technology Inc.
-
Ông. Phần #MT47H32M16NF-25E:H
-
Có sẵn5309
365 Đảm bảo chất lượng ngày
7*24 giờ dịch vụ quarantee
90-Bảo hành sau bán hàng ngày
Bảo hành sản phẩm chính xác
Thông số kỹ thuật
| thuộc tính | Giá trị |
| Part Status | Active |
| Base Product Number | MT47H32M16 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR2 |
| Memory Size | 512Mbit |
| Memory Organization | 32M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 400 MHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | 0°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package | 84-TFBGA |
| Supplier Device Package | 84-FBGA (8x12.5) |
| Packaging | Bulk |
| Access Time | 400 ps |
Tổng quan
Description
This particular model features a density of 512Mb, organized as 32M x 16 bits. It operates with a clock speed of 400 MHz, which corresponds to a data transfer rate of up to 800 MT/s (Megatransfers per second), due to the double data rate nature that allows data to be transferred on both the rising and falling edges of the clock signal. The "25E" in its designation indicates a specific speed grade with a latency of CL5 (CAS Latency 5).
The ":H" denotes a RoHS-compliant product, meaning it adheres to environmental standards that restrict the use of certain hazardous materials. This memory chip is commonly used in applications requiring efficient energy consumption and high-performance memory solutions.
Equivalent
Features
1. Density and Organization: It has a 512Mb density, organized as 32M x 16 bits.
2. Speed: The component operates with a clock speed of 400 MHz, translating to a data rate of 800 MT/s (megatransfers per second).
3. Latency: CAS latency options are available, typically CL = 5, providing flexibility in performance tuning.
4. Voltage: It operates at a standard voltage of 1.8V, which is typical for DDR2 memory, balancing performance and power consumption.
5. Packaging: The component is housed in a 84-ball FBGA package, which helps in efficient thermal performance and space-saving on PCBs.
6. Features: Offers features like programmable burst lengths, auto precharge, and on-die termination (ODT) for improved signal integrity.
7. Applications: It is suitable for a variety of applications, including computing, networking, and other electronics that require efficient memory solutions.
These features make it a versatile and efficient choice for systems requiring moderate memory performance.
Pinout
In terms of pin count, the FBGA package features 84 balls. Each of these pins has specific functions related to the operation of the DRAM, including:
- Address and Control Pins: These include address lines (A0-A13), bank address lines (BA0-BA2), and command inputs such as chip select (CS#), row address strobe (RAS#), column address strobe (CAS#), and write enable (WE#).
- Data Pins: The chip features 16 data input/output pins (DQ0-DQ15) and data strobes (DQS and DQS#).
- Power and Ground Pins: Various VDD and VSS pins provide power and ground connections.
- Clock Pins: CLK and CLK# are used for the clock signal.
- Other Pins: Include CKE (clock enable), ODT (on-die termination), and DM (data mask).
These pins allow the chip to interface with other components, manage data flow, and perform read/write operations efficiently.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What type of memory is the MT47H32M16NF-25E:H?
A: It is a volatile DDR2 SDRAM with 512Mbit capacity organized as 32M x 16 bits.
Q: What is the maximum operating clock frequency of this DRAM?
A: The clock frequency is 400 MHz, enabling a data rate of 800 Mbps per pin.
Q: What is the required voltage supply range for this component?
A: It operates within a 1.7V to 1.9V supply range, typical for DDR2 memory.
Q: What is the access time of this memory device?
A: It has an access time of 400 ps (0.4 ns), ensuring fast read operations.
Q: What package does the MT47H32M16NF-25E:H come in?
A: It uses an 84-TFBGA package with dimensions of 8x12.5 mm (84-FBGA).
Q: Is this memory suitable for industrial temperature applications?
A: It operates from 0°C to 85°C (TC), suitable for commercial and extended commercial environments.
Q: What is the write cycle time for word or page operations?
A: The write cycle time (tWR) for word or page access is 15 ns.