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SM712-TP
+BOMTVS DIODE 12VWM 21VC SOT23
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Nhà sản xuấtCông ty Thương mại Micro
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Ông. Phần #SM712-TP
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Bảng dữ liệu SM712-TP DataSheet
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Gói SOT-23-3
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Có sẵn3042
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Type | Zener |
| Bidirectional Channels | 2 |
| Voltage - Reverse Standoff (Typ) | 12V (Max) |
| Voltage - Breakdown (Min) | 13.3V |
| Voltage - Clamping (Max) @ Ipp | 21V |
| Current - Peak Pulse(10 / 1000µs) | 5A (8/20µs) |
| Power - Peak Pulse | 400W |
| Power Line Protection | No |
| Applications | General Purpose |
| Capacitance @ Frequency | 45pF @ 1MHz |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
Tổng quan
Description
The coating is known for its strong adhesion, durability, and ability to withstand extreme temperatures. It provides a robust barrier that helps extend the lifespan of metal and other substrate materials. SM712-TP is often composed of advanced polymers or resins, which contribute to its protective qualities and make it effective even under challenging conditions.
Application methods for SM712-TP can vary, but they usually include spraying, brushing, or dipping, depending on the specific requirements of the project. Proper surface preparation is crucial to ensure optimal adhesion and performance of the coating.
Overall, SM712-TP is valued for its effectiveness in prolonging the service life of equipment and infrastructure, thereby reducing maintenance costs and downtime.
Equivalent
Pinout
The SM712-TP has 3 pins. Its main function is to protect two data lines from ESD and other transient voltage events by clamping the voltage to a safe level. The device is usually connected in parallel with the protected line. Upon encountering a transient voltage spike, the SM712-TP diverts the excess energy away from the sensitive circuit components.
Key features include low clamping voltage, low leakage current, and fast response time, making it ideal for high-speed data line protection in telecommunications, computing, and consumer electronics applications.