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TCS4525
+BOM-
Nhà sản xuấtJLCPCB Assembly
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Ông. Phần #TCS4525
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Có sẵn3500
365 Đảm bảo chất lượng ngày
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Manufacturer | JLCPCB Assembly |
| Package | CSP20_1R96X1R56X0R66 |
Tổng quan
Description
Equivalent
The TCS4525 is a temperature sensor with digital output. Equivalent alternatives include:
- TCN75A (Microchip)
- LM75 (Texas Instruments/NXP)
- DS75 (Maxim Integrated)
- MCP9808 (Microchip, higher accuracy)
These chips offer similar I²C interfaces and temperature sensing capabilities. Check specifications for exact voltage ranges, accuracy, and package compatibility.
- TCN75A (Microchip)
- LM75 (Texas Instruments/NXP)
- DS75 (Maxim Integrated)
- MCP9808 (Microchip, higher accuracy)
These chips offer similar I²C interfaces and temperature sensing capabilities. Check specifications for exact voltage ranges, accuracy, and package compatibility.
Pinout
The TCS4525 is a 16-pin (TSSOP package) CMOS image sensor IC. Key functions include:
- Image Capture: 640x480 resolution (VGA) with a 1/11-inch optical format.
- Output: 10-bit digital video output (DVP interface).
- Control: Supports I²C for configuration (slave address: 0x78).
- Power: Operates at 2.8V (analog/core) and 1.8V (I/O).
- Features: Automatic exposure control, frame rate up to 30fps, and low-power standby mode.
Pins include power (VDD, VDDIO), ground (GND), I²C (SCL, SDA), pixel clock (PCLK), and data outputs (D[9:0]).
- Image Capture: 640x480 resolution (VGA) with a 1/11-inch optical format.
- Output: 10-bit digital video output (DVP interface).
- Control: Supports I²C for configuration (slave address: 0x78).
- Power: Operates at 2.8V (analog/core) and 1.8V (I/O).
- Features: Automatic exposure control, frame rate up to 30fps, and low-power standby mode.
Pins include power (VDD, VDDIO), ground (GND), I²C (SCL, SDA), pixel clock (PCLK), and data outputs (D[9:0]).
Package
The TCS4525 is typically available in a QFN (Quad Flat No-leads) package, specifically a 4x4 mm QFN-24 variant. This compact, surface-mount package is designed for efficient thermal performance and space-saving PCB integration, suitable for power management applications.
