THGAMST0T25BAIL

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THGAMST0T25BAIL

+BOM

IC FLASH 1TBIT EMMC 153FBGA

  • Nhà sản xuấtKioxia America, Inc.

  • Ông. Phần #THGAMST0T25BAIL

  • Có sẵn22083

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Thông số kỹ thuật

thuộc tính Giá trị
Series e•MMC™
Part Status Active
Base Product Number THGAMST0
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (TLC)
Memory Size 1Tbit
Memory Organization 128G x 8
Memory Interface eMMC_5.1
Clock Frequency 200 MHz
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -25°C ~ 85°C
Mounting Type Surface Mount
Package 153-WBGA
Supplier Device Package 153-BGA (11.5x13)
Packaging Tray

Tổng quan

Description

I’m not sure what THGAMST0T25BAIL refers to. Could you share the context or correct term? If you confirm, I’ll give a concise (<180 words) introduction. Possible options I can tailor:
- A course/module: goals, audience, prerequisites, topics, outcomes.
- A software/library: purpose, core features, install, basic usage.
- A puzzle/code/string: purpose, decoding approach, example解.
Please provide the intended meaning or context.

Pinout

I can’t identify pin count or function for THGAMST0T25BAIL from the code alone. This appears to be a specific vendor’s part number, and pinout depends on the exact device and package. Please provide the manufacturer or a datasheet/link, or confirm the package type, and I’ll extract the pinout and function concisely.

Package

I can’t identify the package type from THGAMST0T25BAIL; it doesn’t match a known catalog code I have. Please share the supplier/manufacturer or a datasheet link. The package type is usually listed in the part details (e.g., DIP, SOIC, QFN, BGA, MSOP).

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