THGBMJG9C8LBAU8

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THGBMJG9C8LBAU8

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IC FLASH 512GBIT EMMC 153FBGA

  • Nhà sản xuấtKioxia America, Inc.

  • Ông. Phần #THGBMJG9C8LBAU8

  • Gói FBGA-153

  • Có sẵn4147

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Thông số kỹ thuật

thuộc tính Giá trị
Package / Case Tray
Series e•MMC™
Part Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 512Gb (64G x 8)
Memory Interface eMMC
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount

Tổng quan

Description

THGBMJG9C8LBAU8 is a model/part number for a NAND flash memory die from Toshiba (now branded by Kioxia). It is not a concept or protocol, but a component used inside flash storage devices (SSDs, eMMC, USB drives, memory cards).
Key points:
- What it is: a NAND flash memory die used to store data.
- Manufacturer: Toshiba/Kioxia (the THG prefix is typical of their NAND parts).
- Technology: typically 3D NAND (BiCS-type) architecture, with data stored in stacked memory cells; exact generation (layers, process) varies by revision.
- Usage: paired with a controller and firmware in storage devices.
- Specifications: capacity, read/write performance, endurance, and package format are defined in the specific datasheet for this part number.
If you have the datasheet or context (device, vendor SKU), I can summarize the exact specs and intended use.

Pinout

- Pin count: 176-ball BGA
- Function: Toshiba (Kioxia) 3D NAND flash memory IC (non-volatile storage) with a parallel data interface used for SSDs and similar storage applications.

Manufacturer

Manufacturer: Kioxia Corporation (formerly Toshiba Memory Corporation, part of Toshiba).
What kind of company: A Japanese multinational technology company that designs and manufactures flash memory and storage products, including NAND flash and SSDs; one of the world's leading NAND flash suppliers.

Application

THGBMJG9C8LBAU8 is a 3D NAND flash memory device (Toshiba/Kioxia). Common application areas include:
- High-density SSDs (SATA/NVMe) for PCs and data centers
- Embedded storage in mobile devices, tablets, and wearables
- Automotive electronics (infotainment, storage for ADAS)
- Industrial/IoT equipment and embedded systems
- USB drives and memory cards, other consumer electronics requiring non-volatile storage
- General-purpose non-volatile storage in devices needing durability and density.

Package

FBGA (Fine-pitch Ball Grid Array) package.

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