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THVD1450DR
+BOMIC TRANSCEIVER HALF 1/1 8SOIC
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Nhà sản xuấtTexas Dụng cụ
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Ông. Phần #THVD1450DR
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Gói SOIC (D)-8
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Có sẵn6920
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| Type | Transceiver |
| Protocol | RS485 |
| NumberofDrivers/Receivers | 1/1 |
| Duplex | Half |
| ReceiverHysteresis | 30 mV |
| DataRate | 50Mbps |
| Voltage-Supply | 3V ~ 5.5V |
| OperatingTemperature | -40°C ~ 125°C |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Tổng quan
Description
Featuring a low power standby mode and a wide operating temperature range from -40°C to 125°C, the THVD1450DR is suitable for harsh environments. It provides enhanced protection against electrical interference, including electrostatic discharge (ESD), with a robust tolerance of ±16 kV Human Body Model (HBM). The device also supports a failsafe receiver for open, shorted, or idle bus conditions, ensuring reliable communication.
Its compact design, stability in challenging conditions, and compliance with various industrial standards make the THVD1450DR an excellent choice for applications requiring durable and efficient data transmission solutions.
Equivalent
1. MAX485 from Maxim Integrated – Similar low-power RS-485 transceiver.
2. SN75176B by Texas Instruments – Another RS-485 transceiver with similar features.
3. ADM485 by Analog Devices – A comparable low-power transceiver.
4. LTC485 by Linear Technology/Analog Devices – Offers similar functionality.
5. SP485 by MaxLinear – Another alternative with similar specifications.
These alternatives offer similar functionalities but may have differences in performance and specifications.
Features
1. Data Rate: Supports up to 50 Mbps, making it suitable for high-speed communication.
2. Supply Voltage Range: Operates on a wide voltage range from 3.0V to 5.5V, offering flexibility for various applications.
3. Extended Temperature Range: Functions effectively within a temperature range of -40°C to +125°C, allowing for use in extreme environments.
4. Robust Protection: Features ESD protection up to ±16 kV, ensuring resilience against electrostatic discharge.
5. Low Power Consumption: Incorporates a low-power standby mode, which reduces power usage when the transceiver is not actively transmitting or receiving data.
6. Fail-safe Design: Includes a failsafe receiver for open, short, and idle bus conditions, providing reliable operation even in challenging conditions.
7. Half-Duplex Communication: Supports half-duplex communication, enabling two-way data exchange on a single pair of wires.
These features make the THVD1450DR an ideal choice for applications requiring reliable and high-speed data communication in harsh environments.
Pinout
1. Pin 1 (RO - Receiver Output): This pin outputs the data received by the transceiver.
2. Pin 2 (RE̅ - Receiver Enable): A low signal on this pin enables the receiver, while a high signal disables it.
3. Pin 3 (DE - Driver Enable): A high signal on this pin enables the driver, while a low signal disables it.
4. Pin 4 (DI - Driver Input): This pin is used to input the data to be transmitted by the transceiver.
5. Pin 5 (GND - Ground): Ground reference for the device.
6. Pin 6 (A - Non-Inverting Driver Output/Receiver Input): One of the differential lines for data transmission and reception.
7. Pin 7 (B - Inverting Driver Output/Receiver Input): The other differential line for data transmission and reception.
8. Pin 8 (VCC - Power Supply): Supply voltage for the device.
The device is used for differential data transmission and allows for high-speed data communication in industrial environments.
Manufacturer
As one of the largest semiconductor companies in the world, TI is recognized for its extensive portfolio of products that include analog integrated circuits, embedded processors, digital signal processors, and other related technologies. Their components are crucial in enabling the functionality and efficiency of electronic devices.
Texas Instruments prioritizes research and development, which allows them to stay at the forefront of technological advancements in the semiconductor industry. They are committed to sustainability and responsible manufacturing practices, aiming to reduce their environmental impact and enhance the social well-being of their stakeholders.