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W632GU6RB-11
+BOMIC DRAM 2GBIT PAR 96VFBGA
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Nhà sản xuấtWinbond Electronics
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Ông. Phần #W632GU6RB-11
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Có sẵn9151
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Part Status | Active |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3L |
| Memory Size | 2Gbit |
| Memory Organization | 128M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 933 MHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.283V ~ 1.45V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-VFBGA |
| Supplier Device Package | 96-VFBGA (7.5x13) |
| Packaging | Tube |
| Access Time | 20 ns |
Tổng quan
Description
- W632GU6RB-11 is a model code used by [Vendor] to identify a [device type] (revision 11).
- Purpose: designed for [applications/uses] requiring [key capabilities such as processing, I/O, power range].
- Key features: [feature1], [feature2], [feature3], and interfaces/standards like [USB, UART, etc.].
- Typical specs: [voltage/current], [temperature, size], and [environmental or reliability data].
- Applications: suitable for [industries or use cases].
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the W632GU6RB-11?
A: It has a 2Gbit density organized as 128M x 16 bits, suitable for high-bandwidth parallel DRAM applications.
Q: What voltage supply range does this DDR3L SDRAM require?
A: It operates at a low voltage of 1.283V to 1.45V, complying with DDR3L standards for reduced power consumption.
Q: What is the maximum clock frequency supported by this component?
A: It supports a maximum clock frequency of 933 MHz, enabling high-speed data transfer in memory-intensive systems.
Q: What is the access time and write cycle time for this device?
A: The access time is 20 ns, and the write cycle time for word/page is 15 ns, ensuring efficient read/write operations.
Q: What is the operating temperature range of the W632GU6RB-11?
A: It operates from 0°C to 95°C (TC), making it suitable for industrial and consumer electronics with thermal constraints.
Q: What package type is used for this DDR3L memory?
A: It comes in a 96-VFBGA surface-mount package with dimensions of 7.5x13 mm, ideal for compact PCB layouts.
Q: Can this memory be used in low-power or mobile applications?
A: Yes, as a DDR3L device with a 1.35V nominal supply, it is optimized for energy-efficient designs like laptops and embedded systems.
