W989D6DBGX6I

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W989D6DBGX6I

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IC DRAM 512MBIT PAR 54VFBGA

  • Nhà sản xuấtWinbond Electronics

  • Ông. Phần #W989D6DBGX6I

  • Bảng dữ liệu W989D6DBGX6I DataSheet

  • Có sẵn2421

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Thông số kỹ thuật

thuộc tính Giá trị
Part Status Active
Base Product Number W989D6
Digi Key Programmable Not Verified
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPSDR
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Clock Frequency 166 MHz
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 54-TFBGA
Supplier Device Package 54-VFBGA (8x9)
Packaging Tray
Access Time 5 ns

Tổng quan

Description

"W989D6DBGX6I" doesn't appear to refer to any widely recognized concept, product, or entity as of my last update in October 2023. It seems to be a random or specific alphanumeric code that might be used internally within a company or organization for a particular purpose, such as a product code, SKU, or a project identifier. If this code pertains to a specific context, such as a company's internal documentation or a recently launched product, understanding its significance would require access to that specific context or source.
For a more accurate introduction, additional details or context about what "W989D6DBGX6I" represents would be necessary. If you have a specific field, industry, or company in mind, providing that information could help in understanding and explaining its relevance.

Equivalent

The W989D6DBGX6I is a mobile DRAM chip from Winbond. Equivalent products can include other similar low-power LPDDR3 DRAM chips from manufacturers like Samsung, Micron, and SK Hynix. When seeking equivalents, look for LPDDR3 DRAM with similar specifications such as capacity, speed, and voltage. Specific part numbers will vary, so it's best to compare datasheets to ensure compatibility.

Pinout

The W989D6DBGX6I is a DRAM component from Winbond, specifically a 2Gb (256M x 8) DDR3L SDRAM. It typically comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. The primary function of this DRAM is to provide high-speed data storage and retrieval capabilities, which is commonly used in various electronic devices such as computers, servers, and embedded systems. It operates at a lower voltage compared to standard DDR3, making it suitable for applications that require power efficiency. For precise pin count and detailed pin functions, referring to the manufacturer's datasheet is recommended.

Manufacturer

The W989D6DBGX6I is a part number for a component manufactured by Winbond Electronics Corporation. Winbond is a Taiwanese company that specializes in the design and production of semiconductor products. It is well-known for its dynamic random-access memory (DRAM), static random-access memory (SRAM), and flash memory products, which are widely used in consumer electronics, computers, and various industrial applications. The company is a key player in the memory chip market, providing solutions that enhance the speed, performance, and storage capabilities of electronic devices.

Frequently Asked Questions


Q: What is the memory density and organization of the W989D6DBGX6I?
A: It has a 512Mbit density organized as 32M x 16 bits, suitable for high-bandwidth parallel DRAM applications.


Q: Is this DRAM compatible with standard 1.8V supply voltages?
A: Yes, it operates from 1.7V to 1.95V, making it ideal for mobile and low-power SDRAM designs.


Q: What is the maximum clock frequency supported by this component?
A: It supports a clock frequency of up to 166 MHz, enabling fast data throughput in SDRAM interfaces.


Q: What is the typical access time for this memory chip?
A: The access time is 5 ns, ensuring quick read/write response for time-sensitive DRAM tasks.


Q: What package does the W989D6DBGX6I come in?
A: It is supplied in a 54-TFBGA package (8x9mm), designed for surface-mount assembly in compact designs.


Q: What is the operating temperature range for this memory?
A: It operates from -40°C to 85°C (TA), suitable for industrial and extended-temperature environments.


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