Hình ảnh chỉ để tham khảo
XC3S400A-5FGG320C
+BOMIC FPGA 251 I/O 320FBGA
-
Nhà sản xuấtAMD
-
Ông. Phần #XC3S400A-5FGG320C
-
Có sẵn9097
365 Đảm bảo chất lượng ngày
7*24 giờ dịch vụ quarantee
90-Bảo hành sau bán hàng ngày
Bảo hành sản phẩm chính xác
Thông số kỹ thuật
| thuộc tính | Giá trị |
| Series | Spartan®-3A |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 368640 |
| Number of I/O | 251 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S400 |
| Number of Logic Elements/Cells | 8064 |
| Number of LABs/CLBs | 896 |
Tổng quan
Description
Key features include:
- Configurable Logic Blocks (CLBs): Comprised of slices with look-up tables (LUTs) and flip-flops for implementing combinatorial and sequential logic.
- Block RAM: The device offers embedded memory for data storage and buffering.
- I/O Support: Supports a variety of I/O standards, enhancing compatibility with different peripherals.
- Development Tools: Compatible with Xilinx ISE tools for design entry, simulation, and programming.
The XC3S400A is ideal for applications in communications, automotive, consumer electronics, and industrial control systems, emphasizing flexibility and reconfigurability.
Equivalent
Features
1. Logic Cells: Approximately 400,000 system gates and 12,000 logic cells.
2. Configurable I/O: Supports up to 320 user I/O pins with various voltage standards for flexibility.
3. Performance: Offers a maximum clock frequency of 200 MHz.
4. Embedded Memory: Includes 18K-bit block RAM, providing substantial storage for data processing.
5. DSP Slices: Contains dedicated DSP blocks (28 x 18 multipliers) for efficient signal processing.
6. Power Consumption: Designed for low power consumption, making it suitable for portable applications.
7. Development Support: Compatible with Xilinx ISE design tools for easy implementation and programming.
8. Package: Available in a fine-pitch ball grid array (FBGA) package, enhancing thermal performance and reliability.
These features make the XC3S400A-5FGG320C ideal for a variety of applications, including automotive, industrial, and consumer electronics.
Pinout
The functions of the XC3S400A include digital logic implementation, signal processing, and interfacing with various protocols. It supports a wide range of I/O standards, including LVTTL, LVCMOS, and others, allowing for flexible connectivity with external components. Additionally, it offers embedded multipliers and block RAM for efficient data handling and processing.
This FPGA is commonly used in applications such as communications, automotive systems, and consumer electronics, where customizable hardware logic is essential.
Manufacturer
Xilinx's products are widely used in various industries for tasks ranging from data processing and storage to digital signal processing and software-defined networking. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in high-performance computing and accelerating the development of innovative technologies. Overall, Xilinx is regarded as a key player in the semiconductor industry, focusing on providing cutting-edge solutions that enable designers to create complex electronic systems efficiently.
Application
1. Consumer Electronics: Video processing, imaging, and display systems.
2. Industrial Automation: Control systems, robotics, and data acquisition.
3. Communications: Networking devices, wireless protocols, and signal processing.
4. Automotive: Advanced driver-assistance systems (ADAS) and infotainment.
5. Medical Devices: Imaging and diagnostic equipment.
6. Aerospace and Defense: Radar, signal intelligence, and avionics.
Its flexibility, low power consumption, and integration capabilities make it suitable for diverse applications across various industries.