Thông số kỹ thuật
| thuộc tính | Giá trị |
| Supplier | AMD Xilinx |
| Package / Case | Tray |
| Series | Spartan®-3A DSP |
| Part Status | Active |
| Number of LABs/CLBs | 5968 |
| Number of Logic Elements/Cells | 53712 |
| Total RAM Bits | 2322432 |
| Number of I/O | 469 |
| Number of Gates | 3400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Tổng quan
Description
XC3SD3400A-4FGG676C is a Xilinx Spartan-3A FPGA in a 676-ball FG676 package. It belongs to the mid-density Spartan-3A family and targets cost‑efficient, programmable logic for embedded, control, and digital‑signal processing applications. The device combines LUT‑based logic cells with DSP slices, block RAM and distributed RAM, plus multiple I/O banks and clock management resources. The -4 speed grade indicates its timing performance within the family; the “C” suffix denotes commercial temperature range. The FG676 package enables dense integration on compact boards. Configuration is typically via JTAG or Slave Serial (and can use SPI‑PROM). Tools: Xilinx ISE for synthesis and implementation, producing a bitstream to program the device. Note: this is an older device—check current availability and consider newer FPGAs for new designs.
Features
XC3SD3400A-4FGG676C is a Spartan-3A DSP FPGA in a 676-pin FG676 package (speed grade -4). Key features:
- About 3.4k logic cells for flexible logic implementation
- Built-in DSP fabric with multipliers for high‑speed signal processing
- On‑chip RAM: distributed RAM and block RAM resources
- Multiple I/O banks with 3.3V I/O tolerance; supports common standards (LVTTL/LVCMOS, etc.)
- Clock management: internal PLLs/DCMs for timing and frequency synthesis
- Configuration interfaces: JTAG and related configuration options
- Dense, power-aware FPGA fabric suitable for DSP, communications, image/video processing
- Commercial (C) grade temperature range and industrial-grade variants available in other parts of the family
Note: for exact counts (logic cells, RAM bits, DSP slices) and feature details, consult the official datasheet.
- About 3.4k logic cells for flexible logic implementation
- Built-in DSP fabric with multipliers for high‑speed signal processing
- On‑chip RAM: distributed RAM and block RAM resources
- Multiple I/O banks with 3.3V I/O tolerance; supports common standards (LVTTL/LVCMOS, etc.)
- Clock management: internal PLLs/DCMs for timing and frequency synthesis
- Configuration interfaces: JTAG and related configuration options
- Dense, power-aware FPGA fabric suitable for DSP, communications, image/video processing
- Commercial (C) grade temperature range and industrial-grade variants available in other parts of the family
Note: for exact counts (logic cells, RAM bits, DSP slices) and feature details, consult the official datasheet.
Pinout
- Pin count: 676 pins (FGG676 package).
- Function: Spartan-3SD FPGA with ~3,400 logic cells, in a 676-pin Fine-GG BGA package; speed grade -4.
- Function: Spartan-3SD FPGA with ~3,400 logic cells, in a 676-pin Fine-GG BGA package; speed grade -4.
Manufacturer
- Manufacturer: Xilinx, Inc. (now part of AMD as AMD’s Programmable Solutions Group)
- Company type: American multinational semiconductor company specializing in programmable logic devices (FPGAs, CPLDs) and related design software.
- Company type: American multinational semiconductor company specializing in programmable logic devices (FPGAs, CPLDs) and related design software.
Application
Application areas for XC3SD3400A-4FGG676C include:
- Embedded control and soft-processor implementations
- Digital signal processing (filters, FFTs) and data-path acceleration
- High-density logic, state machines and glue logic
- Interface bridges and high-speed I/O (SPI/I2C/LVDS/parallel)
- Video/audio preprocessing and multimedia interfaces
- Data acquisition, instrumentation and test/measurement
- Automotive, industrial and aerospace/defense electronics
- Prototyping, education and research platforms
These cover common FPGA use cases for high-density Spartan-3S devices.
- Embedded control and soft-processor implementations
- Digital signal processing (filters, FFTs) and data-path acceleration
- High-density logic, state machines and glue logic
- Interface bridges and high-speed I/O (SPI/I2C/LVDS/parallel)
- Video/audio preprocessing and multimedia interfaces
- Data acquisition, instrumentation and test/measurement
- Automotive, industrial and aerospace/defense electronics
- Prototyping, education and research platforms
These cover common FPGA use cases for high-density Spartan-3S devices.
Package
FineLine BGA package (FGG676) with 676 balls; the “-C” suffix denotes Commercial temperature range.
