Thông số kỹ thuật
| thuộc tính | Giá trị |
| Package / Case | Tray |
| Series | Artix-7 |
| Part Status | Active |
| Number of LABs/CLBs | 2600 |
| Number of Logic Elements/Cells | 33280 |
| Total RAM Bits | 1843200 |
| Number of I/O | 210 |
| Voltage - Supply | 0.95V ~ 1.05V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
Tổng quan
Description
XC7A35T-L2CSG324E is a mid-range Xilinx Artix-7 FPGA (28nm, 7-series). It’s designed for low power and cost-sensitive designs that still need substantial logic density and I/O.
Key points:
- Density and resources: tens of thousands of logic cells, LUTs/FFs, DSP slices, and block RAM, suitable for mixed-signal and digital logic.
- I/O and packaging: multiple I/O banks in a 324-ball CSBGA package (CSG324) for dense, flexible connectivity.
- Clocking and logic: hardened clocking resources (PLLs/MMCMs), carry chains, and efficient routing for high-performance designs.
- Tooling: supported by Xilinx design tools (Vivado) with 7-series IP and design flows.
- Typical applications: industrial and consumer electronics, motor control, embedded processing, video, and communications.
In short, XC7A35T-L2CSG324E offers a balance of density, performance, and low power for cost-conscious FPGA projects.
Key points:
- Density and resources: tens of thousands of logic cells, LUTs/FFs, DSP slices, and block RAM, suitable for mixed-signal and digital logic.
- I/O and packaging: multiple I/O banks in a 324-ball CSBGA package (CSG324) for dense, flexible connectivity.
- Clocking and logic: hardened clocking resources (PLLs/MMCMs), carry chains, and efficient routing for high-performance designs.
- Tooling: supported by Xilinx design tools (Vivado) with 7-series IP and design flows.
- Typical applications: industrial and consumer electronics, motor control, embedded processing, video, and communications.
In short, XC7A35T-L2CSG324E offers a balance of density, performance, and low power for cost-conscious FPGA projects.
Features
XC7A35T-L2CSG324E is an Artix-7 FPGA in a 324-ball BGA package. Key features:
- 28nm Artix-7 logic fabric with speed grade -2
- Approx. 33k logic cells (LUT/FF-based)
- On-chip memory: Block RAM blocks plus distributed RAM
- DSP resources for real-time MAC operations
- Clocking: multiple PLL/MMCM clock managers
- I/O: hundreds of user I/Os across multiple banks, with broad I/O standards support ( LVDS/LVCMOS, etc.)
- Built-in configuration logic and fast carry chains
- Low-power design optimized for cost-per-performance in mid-range applications
Note: exact resource counts vary by device revision; this variant emphasizes density, memory, DSP, and flexible I/O within a 324-ball package.
- 28nm Artix-7 logic fabric with speed grade -2
- Approx. 33k logic cells (LUT/FF-based)
- On-chip memory: Block RAM blocks plus distributed RAM
- DSP resources for real-time MAC operations
- Clocking: multiple PLL/MMCM clock managers
- I/O: hundreds of user I/Os across multiple banks, with broad I/O standards support ( LVDS/LVCMOS, etc.)
- Built-in configuration logic and fast carry chains
- Low-power design optimized for cost-per-performance in mid-range applications
Note: exact resource counts vary by device revision; this variant emphasizes density, memory, DSP, and flexible I/O within a 324-ball package.
Pinout
- Pin count: 324 pins (324-ball BGA)
- Function: XC7A35T is an Artix-7 FPGA (field-programmable gate array) device in the L2CSG324E package.
- Function: XC7A35T is an Artix-7 FPGA (field-programmable gate array) device in the L2CSG324E package.
Manufacturer
- Manufacturer: Xilinx (now a subsidiary of AMD)
- Company type: A semiconductor company that designs and markets programmable logic devices, mainly FPGAs (and related SoCs and tools).
- Company type: A semiconductor company that designs and markets programmable logic devices, mainly FPGAs (and related SoCs and tools).
Application
XC7A35T-L2CSG324E is an Artix-7 mid-density FPGA (low power, cost-effective) suitable for flexible DSP/logic tasks. Common application areas include:
- Industrial automation and motor control (PLC, robotics, servo drives)
- Communications and networking (baseband processing, packet handling, transceivers)
- Embedded vision and video processing (camera pipelines, image analysis)
- Automotive electronics (gateway, body electronics, instrumentation)
- Medical instrumentation and scientific data acquisition
- Consumer electronics and edge devices (gateways, smart sensors, prototyping)
- Industrial automation and motor control (PLC, robotics, servo drives)
- Communications and networking (baseband processing, packet handling, transceivers)
- Embedded vision and video processing (camera pipelines, image analysis)
- Automotive electronics (gateway, body electronics, instrumentation)
- Medical instrumentation and scientific data acquisition
- Consumer electronics and edge devices (gateways, smart sensors, prototyping)
Package
324-ball Chip-Scale Ball Grid Array (CSG324) package.
