XCZU6CG-1FFVB1156E

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XCZU6CG-1FFVB1156E

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IC SOC CORTEX-A53 1156FCBGA

  • Nhà sản xuấtAMD Xilinx

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  • Gói BBGA-1156

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Thông số kỹ thuật

thuộc tính Giá trị
Supplier AMD Xilinx
Package / Case Bulk
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)

Tổng quan

Description

XCZU6CG-1FFVB1156E is a Xilinx Zynq UltraScale+ MPSoC device (ZU6CG family). It combines a Processing System (ARM Cortex-A53 quad-core with Cortex-R5 real-time cores) and Programmable Logic on a single chip, enabling software and hardware acceleration in one package. It is packaged in a flip-chip BGA (FFVB) with 1,156 balls and a -1 speed grade. The device offers high-speed transceivers, memory controllers (DDR4/LPDDR4), PCIe, USB and other I/O, plus tight PS–PL interconnect for flexible hardware/software co-design. Typical applications include embedded vision, automotive, industrial automation, and communications at the edge. Development uses Xilinx Vivado for PL design and Vitis for software, following a unified PS–PL design flow; boot options commonly include QSPI, eMMC/SD, or flash. In short, a mid-range, versatile MPSoC for integrated processing and programmable logic in embedded systems.

Features

Here are the core features of the XCZU6CG-1FFVB1156E (Zynq UltraScale+ MPSoC):
- Zynq UltraScale+ MPSoC device with Processing System (PS) and Programmable Logic (PL)
- Quad-core 64-bit ARM Cortex-A53 application processor
- Dual-core Cortex-R5 Real-Time Processing Unit (RPU)
- Substantial PL fabric for custom logic and accelerators
- Memory interfaces: DDR4/LPDDR4/LPDDR3 with ECC options
- High-speed SERDES/transceivers for flexible I/O
- I/O interfaces: PCIe Gen3 x4, USB 3.0, SATA 3.0, Ethernet (and other high-speed I/O)
- Video/Subsystem: Video Processing Subsystem (VPS) with VCU/IP blocks for video encode/decode and image processing
- Security features: Crypto Engine, Secure Boot, hardware-based trust protections
- Package: FFVB 1156-ball BGA (industrial/extended temp options)
- Flexible power/performance management suitable for embedded, vision, networking, and AI acceleration use cases
Note: exact counts (PL LUTs/BRAM, memory bandwidth, I/O counts) vary by device revision; this covers the key capability areas.

Pinout

Pin count: 1156 (FFVB1156 = 1156-ball BGA package).
Function (concise): The XCZU6CG-1FFVB1156E is an AMD/Xilinx Zynq UltraScale+ MPSoC. It combines a processing system (multi‑core ARM Cortex‑A53 application processors plus dual Cortex‑R5 real‑time processors) with programmable FPGA fabric, memory controllers, high‑speed serial transceivers, and rich I/O/peripheral interfaces — intended for embedded SoC applications requiring tight CPU/FPGA integration, hardware acceleration, and high‑bandwidth I/O.

Manufacturer

Manufacturer: Xilinx (now part of AMD).
What kind of company: Xilinx is a semiconductor company that designs programmable logic devices—primarily FPGAs, SoCs and adaptive/accelerated processing platforms (e.g., the Zynq UltraScale+ family)—plus associated development software. It focuses on high-performance, configurable hardware for communications, data center acceleration, embedded systems, automotive, aerospace and industrial applications.

Application

XCZU6CG-1FFVB1156E is a Zynq UltraScale+ MPSoC (ZU6) device. Common application areas include:
- Industrial automation and control (PLC, motor control, robotics)
- Embedded vision and imaging (machine vision cameras, medical imaging)
- Automotive and transportation (in-vehicle ECUs, gateways, vision processing)
- Communications and networking (edge processors, baseband, packet processing)
- Aerospace/defense embedded systems (ruggedized/mission-critical controllers)
- Edge AI and data processing (AI inference, DSP/FPGA acceleration)

Package

It uses a Flip-Chip Ball Grid Array package: FFVB1156 (FFVB) with 1156 balls.

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