10M16DAF256I7G vs 10M16DAF256C8G

Bảng so sánh chi tiết giữa 10M16DAF256I7G và 10M16DAF256C8G cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M16DAF256C8G and 10M16DAF256I7G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The commercial-grade C8G variant is suitable for standard temperature environments, while the industrial-grade I7G variant supports extended temperature ranges, making it the appropriate choice for harsh-environment applications. Both devices are drop-in compatible when thermal requirements are properly matched to the target application.

Logic Density High match
Package Type High match
Operating Temperature Validation required
Supply Voltage High match

Parts at a glance

Part A

10M16DAF256I7G

Intel

Lifecycle
Active
Stock
6815 PCS
Package
BGA-256
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

10M16DAF256C8G

Intel

Lifecycle
Active
Stock
4171 PCS
Package
BGA-256
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M16DAF256C8G 10M16DAF256I7G Why it matters
Operating Temperature Range 0°C to 85°C (Commercial) -40°C to 100°C (Industrial) Determines the environments in which the device can reliably operate; industrial-grade parts are required for harsh or outdoor applications.
Speed Grade 8 7 A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable clock rates and timing closure.
Logic Elements (LEs) 16000 16000 Defines the available programmable logic capacity for implementing custom digital functions.
Package 256-pin FBGA 256-pin FBGA Must match the PCB footprint and assembly process for a drop-in replacement.
Embedded Memory 588288 bits 588288 bits Provides on-chip storage for data buffering, FIFOs, and configuration, affecting design capability.
Number of I/O Pins 178 178 Determines how many external signals and peripherals the device can interface with.
Supply Voltage 1.15V to 1.25V (core) 1.15V to 1.25V (core) Core voltage must match the board power design for correct operation and reliability.
Embedded Multipliers (18x18) 160 160 Affects DSP throughput for multiplication-intensive applications such as filtering and signal processing.
PLLs 4 4 Phase-locked loops provide clock synthesis and management needed for multi-clock designs.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M16DAF256I7G 10M16DAF256C8G
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs 1000 1000
Number of Logic Elements/Cells 16000 16000
Total RAM Bits 562176 562176
Number of I/O 178 178
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the 10M16DAF256C8G and 10M16DAF256I7G devices?

Both are Intel (formerly Altera) MAX 10 family field-programmable gate arrays (FPGAs) in a 256-ball FineLine BGA (FBGA) package. They share the same 16,000 logic elements (LEs) density, integrated analog-to-digital converter (ADC) blocks, and non-volatile flash configuration. The suffix difference indicates the operating temperature grade: C8G denotes commercial temperature range with speed grade 8, while I7G denotes industrial temperature range with speed grade 7.

What is the difference between the C8G and I7G suffixes on these MAX 10 FPGAs?

The C8G suffix indicates a commercial temperature grade (typically 0°C to 85°C junction temperature) and speed grade 8. The I7G suffix indicates an industrial temperature grade (typically -40°C to 100°C junction temperature) and speed grade 7. Speed grade 7 is faster than speed grade 8, meaning the I7G device supports higher maximum operating frequencies for the same logic design.

Are the 10M16DAF256C8G and 10M16DAF256I7G pin-to-pin compatible?

Yes. Both devices use the same 256-ball FineLine BGA package with identical pinouts as defined in the Intel MAX 10 device pin-out files. The package footprint, ball assignments, and I/O bank locations are the same, allowing a common PCB layout. However, the industrial I7G version may have different timing closure requirements due to its faster speed grade.

Can the 10M16DAF256C8G be substituted with the 10M16DAF256I7G in an existing design?

Substitution is possible only after validating the design against the industrial temperature range and the faster speed grade. The I7G device is rated for -40°C to 100°C junction temperature, which covers the commercial range, and its speed grade 7 timing is faster than speed grade 8. The design must be re-timed and verified to ensure no hold-time violations occur with the faster device. Intel Quartus Prime software must be used to recompile the design targeting the I7G device.

What are the typical operating temperature ranges for the C8G and I7G grades?

Based on Intel MAX 10 datasheets, the commercial C8G grade supports a junction temperature range of 0°C to 85°C. The industrial I7G grade supports a junction temperature range of -40°C to 100°C. These ranges are specified for the device junction temperature, not ambient temperature, and proper thermal analysis is required for the target application.

Do both devices support the same configuration methods?

Yes. Both the 10M16DAF256C8G and 10M16DAF256I7G support identical configuration schemes, including internal configuration from the on-chip flash, active serial (AS), passive serial (PS), and JTAG configuration. The configuration flash memory (CFM) size and the available configuration interfaces are the same for both temperature grades and speed grades within the same device density.

What are the power supply requirements for these MAX 10 devices?

Both devices require the same nominal power supplies as specified in the Intel MAX 10 device datasheet: VCCINT (1.2 V core), VCCA (3.0 V or 3.3 V analog supply for ADC), and VCCIO for each I/O bank (supporting 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V depending on the I/O standard). The industrial I7G grade may have slightly different power supply tolerance or decoupling requirements under extreme temperatures, which should be verified in the datasheet.

Which device is more suitable for automotive or industrial applications?

The 10M16DAF256I7G is more suitable for industrial and automotive applications because its industrial temperature grade supports -40°C to 100°C junction temperature. The 10M16DAF256C8G commercial grade is limited to 0°C to 85°C junction temperature and is intended for consumer and commercial applications. Automotive-grade variants may have additional qualification requirements not covered by the standard industrial grade.