10M16DAF256I7G
Intel
- Lifecycle
- Active
- Stock
- 6815 PCS
- Package
- BGA-256
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Bảng so sánh chi tiết giữa 10M16DAF256I7G và 10M16DCF484C7G cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.
Replacement verdict
The 10M16DAF256I7G and 10M16DCF484C7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and core architecture, making them functionally related. However, they differ in package type, pin count, and operating temperature grade, so a direct drop-in replacement is not possible without PCB redesign and thermal validation. The 10M16DAF256I7G is the industrial-grade option in a 256-ball FBGA package, while the 10M16DCF484C7G is a commercial-grade device in a 484-ball FBGA package. Designers must verify pinout compatibility, power delivery, and thermal performance before substituting one for the other.
Intel
Intel
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DCF484C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is essential for functional substitutability and toolchain compatibility. |
| Logic Elements (LEs) | 16,000 | 16,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 256-pin FBGA | 484-pin FBGA | Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility, so they are not drop-in replacements. |
| Operating Temperature Range | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | The industrial-grade variant supports harsher environments, while the commercial variant is limited to benign conditions. |
| Speed Grade | 7 | 7 | Identical speed grade means comparable timing performance and maximum operating frequency. |
| Embedded Memory (M9K blocks) | 549,888 bits | 549,888 bits | Equal embedded memory capacity supports the same on-chip data buffering and storage requirements. |
| User I/O Pins | 178 | 320 | The 484-pin package offers significantly more I/O, which may be necessary for designs requiring extensive peripheral interfacing. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage simplifies power supply design and ensures electrical compatibility. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | Both are instant-on, non-volatile FPGAs, eliminating the need for external configuration devices. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DCF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The 10M16DAF256I7G is a MAX 10 FPGA in a 256-pin FineLine BGA package with an industrial temperature grade (I7), while the 10M16DCF484C7G is a MAX 10 FPGA in a 484-pin FineLine BGA package with a commercial temperature grade (C7). Both devices feature 16,000 logic elements (LEs), but they differ in package, pin count, I/O availability, and operating temperature range.
Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with the same embedded memory and DSP resources typical of the 10M16 density grade.
No. The 10M16DAF256I7G uses a 256-pin FineLine BGA package, while the 10M16DCF484C7G uses a 484-pin FineLine BGA package. The different footprints, pin counts, and pin assignments make them physically and electrically incompatible for direct PCB replacement without a redesign.
The 10M16DAF256I7G has an industrial temperature grade (I7), typically supporting operation from -40°C to +100°C junction temperature. The 10M16DCF484C7G has a commercial temperature grade (C7), typically supporting operation from 0°C to +85°C junction temperature. Designers should verify exact thermal specifications in the respective Intel MAX 10 datasheets.
The 10M16DCF484C7G generally offers more user I/O pins because it is housed in a larger 484-pin FineLine BGA package compared to the 256-pin FineLine BGA package of the 10M16DAF256I7G. The exact I/O count depends on the specific device configuration and should be confirmed in the Intel MAX 10 device pin-out files.
Yes. Both the 10M16DAF256I7G and the 10M16DCF484C7G are Intel MAX 10 family FPGAs, featuring non-volatile instant-on configuration, integrated analog-to-digital converters (ADCs), and support for dual configuration images.
The 10M16DAF256I7G is more suitable for industrial applications because its I7 temperature grade supports a wider operating temperature range (-40°C to +100°C junction) compared to the commercial C7 grade of the 10M16DCF484C7G (0°C to +85°C junction). The 10M16DCF484C7G is better suited for commercial or consumer environments.
Yes. Both the 10M16DAF256I7G and the 10M16DCF484C7G support the same MAX 10 configuration schemes, including internal configuration from on-chip flash, dual configuration images, and external configuration via JTAG or active serial modes, as they share the same MAX 10 device architecture.