10M16DAF256I7G vs 10M16DCF484C7G

Bảng so sánh chi tiết giữa 10M16DAF256I7G và 10M16DCF484C7G cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M16DAF256I7G and 10M16DCF484C7G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and core architecture, making them functionally related. However, they differ in package type, pin count, and operating temperature grade, so a direct drop-in replacement is not possible without PCB redesign and thermal validation. The 10M16DAF256I7G is the industrial-grade option in a 256-ball FBGA package, while the 10M16DCF484C7G is a commercial-grade device in a 484-ball FBGA package. Designers must verify pinout compatibility, power delivery, and thermal performance before substituting one for the other.

Logic Density High match
Package Type Validation required
Pin Count Not compatible
Operating Temperature Validation required

Parts at a glance

Part A

10M16DAF256I7G

Intel

Lifecycle
Active
Stock
6815 PCS
Package
BGA-256
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

10M16DCF484C7G

Intel

Lifecycle
Active
Stock
6411 PCS
Package
BGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M16DAF256I7G 10M16DCF484C7G Why it matters
Family / Series MAX 10 MAX 10 Both devices belong to the same Intel MAX 10 FPGA family, which is essential for functional substitutability and toolchain compatibility.
Logic Elements (LEs) 16,000 16,000 Matching logic density ensures equivalent programmable logic capacity for the target design.
Package 256-pin FBGA 484-pin FBGA Different package footprints and pin counts affect PCB layout, routing, and mechanical compatibility, so they are not drop-in replacements.
Operating Temperature Range -40°C to 100°C (Industrial) 0°C to 85°C (Commercial) The industrial-grade variant supports harsher environments, while the commercial variant is limited to benign conditions.
Speed Grade 7 7 Identical speed grade means comparable timing performance and maximum operating frequency.
Embedded Memory (M9K blocks) 549,888 bits 549,888 bits Equal embedded memory capacity supports the same on-chip data buffering and storage requirements.
User I/O Pins 178 320 The 484-pin package offers significantly more I/O, which may be necessary for designs requiring extensive peripheral interfacing.
Supply Voltage (Core) 1.2 V 1.2 V Same core voltage simplifies power supply design and ensures electrical compatibility.
Configuration Memory Internal configuration flash Internal configuration flash Both are instant-on, non-volatile FPGAs, eliminating the need for external configuration devices.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M16DAF256I7G 10M16DCF484C7G
Supplier - Intel
Series MAX® 10 MAX® 10
Part Status Active Active
Number of LABs/CLBs 1000 1000
Number of Logic Elements/Cells 16000 16000
Total RAM Bits 562176 562176
Number of I/O 178 320
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 10M16DAF256I7G and the 10M16DCF484C7G?

The 10M16DAF256I7G is a MAX 10 FPGA in a 256-pin FineLine BGA package with an industrial temperature grade (I7), while the 10M16DCF484C7G is a MAX 10 FPGA in a 484-pin FineLine BGA package with a commercial temperature grade (C7). Both devices feature 16,000 logic elements (LEs), but they differ in package, pin count, I/O availability, and operating temperature range.

Do the 10M16DAF256I7G and 10M16DCF484C7G have the same logic density?

Yes. Both devices are part of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with the same embedded memory and DSP resources typical of the 10M16 density grade.

Can the 10M16DAF256I7G and 10M16DCF484C7G be used interchangeably in the same PCB design?

No. The 10M16DAF256I7G uses a 256-pin FineLine BGA package, while the 10M16DCF484C7G uses a 484-pin FineLine BGA package. The different footprints, pin counts, and pin assignments make them physically and electrically incompatible for direct PCB replacement without a redesign.

What are the operating temperature ranges for the 10M16DAF256I7G and 10M16DCF484C7G?

The 10M16DAF256I7G has an industrial temperature grade (I7), typically supporting operation from -40°C to +100°C junction temperature. The 10M16DCF484C7G has a commercial temperature grade (C7), typically supporting operation from 0°C to +85°C junction temperature. Designers should verify exact thermal specifications in the respective Intel MAX 10 datasheets.

Which device offers more user I/O pins, the 10M16DAF256I7G or the 10M16DCF484C7G?

The 10M16DCF484C7G generally offers more user I/O pins because it is housed in a larger 484-pin FineLine BGA package compared to the 256-pin FineLine BGA package of the 10M16DAF256I7G. The exact I/O count depends on the specific device configuration and should be confirmed in the Intel MAX 10 device pin-out files.

Are both the 10M16DAF256I7G and 10M16DCF484C7G part of the Intel MAX 10 FPGA family?

Yes. Both the 10M16DAF256I7G and the 10M16DCF484C7G are Intel MAX 10 family FPGAs, featuring non-volatile instant-on configuration, integrated analog-to-digital converters (ADCs), and support for dual configuration images.

Which device is more suitable for industrial applications, the 10M16DAF256I7G or the 10M16DCF484C7G?

The 10M16DAF256I7G is more suitable for industrial applications because its I7 temperature grade supports a wider operating temperature range (-40°C to +100°C junction) compared to the commercial C7 grade of the 10M16DCF484C7G (0°C to +85°C junction). The 10M16DCF484C7G is better suited for commercial or consumer environments.

Do both devices support the same configuration methods?

Yes. Both the 10M16DAF256I7G and the 10M16DCF484C7G support the same MAX 10 configuration schemes, including internal configuration from on-chip flash, dual configuration images, and external configuration via JTAG or active serial modes, as they share the same MAX 10 device architecture.