Part A
5CEFA4F23I7N
Intel
- Lifecycle
- Active
- Stock
- 6968 PCS
- Package
- FBGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA4F23I7N and 5CEFA2F23I7 are both Intel (Altera) Cyclone V F-series FPGAs in the same 484-pin FBGA package with identical I7 speed grade and industrial temperature range, making them pin-compatible and functionally interchangeable at the board level. The 5CEFA4F23I7N offers approximately twice the logic density and embedded memory of the 5CEFA2F23I7, so it can directly replace the smaller device when additional resources are required, while the 5CEFA2F23I7 can substitute for the larger device only if the target design fits within its reduced logic, memory, and DSP resources. Designers should confirm resource utilization, transceiver and I/O requirements, and power budget before committing to a drop-in substitution.
Package Type
High match
Speed Grade
High match
Logic Density
Validation required
Embedded Memory
Validation required
Parts at a glance
Part B
5CEFA2F23I7
Intel
- Lifecycle
- Active
- Stock
- 6309 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA4F23I7N | 5CEFA2F23I7 | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 44000 | 25000 | Logic capacity determines the maximum complexity of digital designs the FPGA can implement; a design that fits in one may not fit in the other. |
| Total RAM Bits | 3080192 | 1953792 | Embedded memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can prevent a design from fitting. |
| Number of 18x18 Multipliers | 132 | 75 | DSP multiplier count limits parallel arithmetic throughput for signal processing and math-intensive applications. |
| Number of LABs/CLBs | 1650 | 950 | Logic array blocks determine routing and logic resource granularity; fewer blocks constrain placement and fitting. |
| Total I/O Pins | 224 | 224 | I/O count determines how many external signals can be interfaced; identical counts support similar board-level connectivity. |
| Package / Case | 484-FBGA (23x23) | 484-FBGA (23x23) | Package and footprint must match for physical board compatibility and drop-in replacement. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Temperature grade must meet the application's environmental requirements for reliable operation. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage must match the board's power design; identical rails allow shared power architecture. |
| Series / Family | Cyclone V E | Cyclone V E | Same family ensures compatible toolchain, IP cores, and configuration methodology. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA4F23I7N | 5CEFA2F23I7 |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA4F23I7N and the 5CEFA2F23I7?
The primary difference is the logic density. The 5CEFA4F23I7N is a Cyclone V E FPGA with 49,000 logic elements (LEs), while the 5CEFA2F23I7 is a Cyclone V E FPGA with 25,000 LEs. Both devices are offered in the same 484-pin FBGA package (F23) and share the same industrial temperature grade (I7).
Are the 5CEFA4F23I7N and 5CEFA2F23I7 pin-to-pin compatible?
Yes. Both devices are members of the Altera (Intel) Cyclone V E family and are housed in the identical 484-pin FBGA package with the same F23 pinout. However, designers must verify that the reduced logic and memory resources of the 5CEFA2F23I7 meet the design requirements before substituting it for the 5CEFA4F23I7N.
Can the 5CEFA2F23I7 be used as a direct drop-in replacement for the 5CEFA4F23I7N?
It is not a direct drop-in replacement in all cases. Although the package and pinout are identical, the 5CEFA2F23I7 has approximately half the logic elements (25,000 vs. 49,000) and fewer embedded memory blocks. A design that fully utilizes the 5CEFA4F23I7N resources will not fit in the 5CEFA2F23I7 without modification.
Do both devices operate at the same core and I/O voltage levels?
Yes. Both the 5CEFA4F23I7N and 5CEFA2F23I7 are Cyclone V E devices that support a 1.1 V core voltage and flexible I/O standards. Specific I/O voltage compatibility depends on the bank configuration and must be confirmed using the respective device datasheets and pin-out files.
What is the operating temperature range for the 5CEFA4F23I7N and 5CEFA2F23I7?
Both devices carry the I7 suffix, which indicates an industrial temperature grade. The verified operating junction temperature range for these Cyclone V E devices is -40°C to +100°C (TJ).
Are the transceiver and high-speed interface capabilities identical between the two devices?
No. The 5CEFA4F23I7N and 5CEFA2F23I7 belong to the Cyclone V E family, which does not include high-speed transceivers. Both devices support general-purpose I/O, LVDS, and memory interfaces, but the number of available I/O pins and LVDS pairs may differ due to the different logic densities. Always consult the device pin-out files for exact I/O counts.
Which device is more suitable for a new design with moderate logic requirements?
The 5CEFA2F23I7 is typically more cost-effective and lower power for designs requiring fewer than 25,000 logic elements. The 5CEFA4F23I7N is appropriate when the design requires between 25,000 and 49,000 logic elements or additional embedded memory. Selection should be based on verified resource utilization reports from the design tools.