5CEFA4F23I7N vs 5CEFA2U19A7N

Bảng so sánh chi tiết giữa 5CEFA4F23I7N và 5CEFA2U19A7N cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEFA4F23I7N and 5CEFA2U19A7N are not drop-in replacements for each other. They differ in logic density, package footprint, and I/O pin count, and they operate under different temperature grades. The 5CEFA4F23I7N offers higher logic capacity and more user I/O in a larger FBGA package with industrial temperature support, while the 5CEFA2U19A7N provides lower density and fewer I/O in a smaller UBGA package with automotive temperature qualification. A direct substitution would require board redesign and revalidation.

Different logic density Different package type Different I/O count Different temperature grade

Parts at a glance

Part A

5CEFA4F23I7N

Intel

Lifecycle
Active
Stock
6968 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEFA2U19A7N

Intel

Lifecycle
Active
Stock
2002 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEFA4F23I7N 5CEFA2U19A7N Why it matters
Family / Series Cyclone V E Cyclone V E Same FPGA family ensures toolchain, IP, and pinout compatibility for migration.
Logic Elements (LE) 49,000 25,000 Determines available logic capacity; a smaller device may not fit the same design.
Total RAM Bits 3,080,000 1,536,000 On-chip memory affects buffering, FIFO depth, and whether a design fits without external RAM.
Number of I/Os 224 224 I/O count must match board routing and peripheral requirements.
Package / Case 484-FBGA (23x23) 484-UBGA (19x19) Different package footprint and ballout prevent direct drop-in replacement on the same PCB.
Operating Temperature -40°C to 100°C (TJ) -40°C to 100°C (TJ) Industrial temperature range is required for reliable operation in harsh environments.
Supply Voltage 1.07V to 1.13V core 1.07V to 1.13V core Core voltage must match power supply design and sequencing requirements.
Transceiver Count 0 0 Absence of high-speed transceivers limits use to general logic and I/O applications.
Speed Grade 7 (fastest) 7 (fastest) Speed grade affects maximum clock frequency and timing closure margin.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEFA4F23I7N 5CEFA2U19A7N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 18480 9434
Number of Logic Elements/Cells 49000 25000
Total RAM Bits 3464192 2002944
Number of I/O 224 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 125°C (TJ)

Frequently asked questions

What are the key differences between the 5CEFA4F23I7N and the 5CEFA2U19A7N?

The 5CEFA4F23I7N is a Cyclone V FPGA with 49,000 logic elements, 308 embedded multipliers, and 3,880 Kbits of embedded memory in a 484-pin FBGA package. The 5CEFA2U19A7N is a Cyclone V FPGA with 25,000 logic elements, 150 embedded multipliers, and 1,880 Kbits of embedded memory in a 484-pin UBGA package. Both operate at a core voltage of 1.1 V and are rated for industrial temperature range (I7 and A7 speed grades).

Are the 5CEFA4F23I7N and 5CEFA2U19A7N pin-to-pin compatible?

No. The 5CEFA4F23I7N uses a 484-pin FBGA package, while the 5CEFA2U19A7N uses a 484-pin UBGA package. Although both have 484 pins, the package types differ, and the pinout assignments are not identical. They cannot be used as direct drop-in replacements without verifying pin functions and PCB layout compatibility.

Can the 5CEFA2U19A7N be used as a substitute for the 5CEFA4F23I7N in an existing design?

No, not directly. The 5CEFA2U19A7N has fewer logic elements (25,000 vs 49,000), fewer embedded multipliers (150 vs 308), and less embedded memory (1,880 Kbits vs 3,880 Kbits). Additionally, the package type differs (UBGA vs FBGA). A redesign would be required to accommodate the reduced resources and different footprint.

What are the operating temperature ranges for these two FPGAs?

Both the 5CEFA4F23I7N and 5CEFA2U19A7N are specified for industrial temperature range operation, typically -40°C to +100°C junction temperature (TJ). The I7 and A7 suffixes indicate industrial-grade speed grades. Always confirm the exact temperature specifications in the respective Intel Cyclone V device datasheet.

Do both devices support the same configuration and transceiver options?

No. The 5CEFA4F23I7N and 5CEFA2U19A7N belong to different Cyclone V variants. The 5CEFA4F23I7N is a Cyclone V E FPGA with 6 transceivers, while the 5CEFA2U19A7N is a Cyclone V E FPGA with 3 transceivers. Configuration schemes and transceiver count differ, so they are not interchangeable in transceiver-dependent designs.

What is the core voltage and typical power consumption difference between these two FPGAs?

Both devices use a 1.1 V core voltage. However, the 5CEFA4F23I7N, with roughly twice the logic density and memory, typically consumes more static and dynamic power than the 5CEFA2U19A7N. Exact power figures depend on design utilization and must be calculated using Intel's Early Power Estimator or PowerPlay tools.

Are these FPGAs RoHS compliant and lead-free?

Yes. Both the 5CEFA4F23I7N and 5CEFA2U19A7N are offered in RoHS-compliant, lead-free packages as standard from Intel and authorized distributors. Verify the specific ordering code and packaging suffix on the manufacturer datasheet to confirm compliance for your production requirements.