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MMZ38333BT1
+BOMIC RF AMP 3.4GHZ-3.8GHZ 24HVQFN
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Nhà sản xuấtNXP Hoa Kỳ Inc.
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Ông. Phần #MMZ38333BT1
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Bảng dữ liệu MMZ38333BT1 DataSheet
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Gói VFQFN-24
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Có sẵn15117
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Supplier | NXP USA Inc. |
| Package / Case | Tape & Reel (TR) |
| Part Status | Active |
| Frequency | 3.4GHz ~ 3.8GHz |
| P1d B | 31.7dBm |
| Gain | 37.9dB |
| Voltage - Supply | 5V |
| Supply Current | 376mA |
| Test Frequency | 3.6GHz |
| Mounting Type | Surface Mount |
Tổng quan
Description
Key features often include a high power gain, low power consumption, and robust construction to withstand different operating environments. The device is likely to support a range of modulation schemes, which is critical for modern communication systems that require flexibility and adaptability in signal processing.
Applications of such amplifiers usually span across multiple domains including telecommunications infrastructure, IoT devices, and any technology reliant on stable and efficient RF signal transmission. Always refer to the manufacturer’s datasheet for specific technical specifications and application guidelines to ensure compatibility with your system requirements.
Equivalent
1. Skyworks SKY65050-372LF
2. Qorvo RFPA3800
3. NXP's BGA7xxx series
Always check the specific requirements of your application to ensure compatibility, as slight differences in specifications can impact performance.
Features
1. Frequency Range: Operates within a wide frequency range, often suitable for applications like LTE, WCDMA, and CDMA.
2. Power Output: Delivers high power output, typically in the range of several watts, making it suitable for use in base stations and repeaters.
3. Efficiency: Designed to provide high power efficiency, which is crucial for reducing power consumption and improving battery life in portable devices.
4. Linearity: Offers excellent linearity, ensuring minimal distortion and high signal quality, which is critical for maintaining the integrity of transmitted signals.
5. Thermal Performance: Equipped with robust thermal management features to prevent overheating and ensure reliable operation under various conditions.
6. Package Type: Comes in a compact and standard package that simplifies integration into existing designs.
7. Reliability: Built to meet rigorous industry standards for reliability, often suitable for both commercial and industrial applications.
These features make the MMZ38333BT1 a valuable component in RF amplification applications.
Pinout
The MMZ38333BT1 is housed in a QFN package with a pin count of 3. This package is designed to provide a compact footprint while allowing efficient heat dissipation and electrical performance. The primary functions of the pins are as follows:
1. RF Input (Pin 1): This pin receives the RF signal that needs amplification.
2. RF Output (Pin 2): This pin outputs the amplified RF signal.
3. Ground (Pin 3): This pin is connected to the ground, providing a reference point for the DC voltage and serving as a heat dissipation path.
This amplifier is built to offer high gain, efficiency, and linearity, making it a critical component in enhancing signal strength and quality in advanced RF applications.