APT30DQ60BG
Công nghệ Microchip
- Lifecycle
- Active
- Stock
- 1309 PCS
- Package
- TO-247-2
- Series
- Diodes - Rectifiers - Single
Bảng so sánh chi tiết giữa APT30DQ60BG và APT30GS60KRG cung cấp những thông tin giá trị về thông số kỹ thuật và các tính năng chính của chúng. Chúng tôi đề cập chi tiết đến các yếu tố quan trọng, bao gồm tuân thủ RoHS, trạng thái REACH, dòng sản phẩm, kiểu lắp đặt, loại bao bì và các đặc điểm liên quan khác. Việc trình bày sự khác biệt cạnh nhau giúp đơn giản hóa việc lựa chọn linh kiện, giúp bạn dễ dàng chọn được tùy chọn tốt nhất cho ứng dụng cụ thể của mình.
Replacement verdict
The APT30GS60KRG is a functional replacement candidate for the APT30DQ60BG, sharing the same 600 V / 30 A fast-recovery diode rating and TO-247 package family, but the reverse-recovery and thermal characteristics differ enough that validation in the target circuit is required before committing to the substitution.
Công nghệ Microchip
Tập đoàn Microsemi
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | APT30DQ60BG | APT30GS60KRG | Why it matters |
|---|---|---|---|
| Package / Mounting Type | TO-247 (through-hole) | D3PAK / TO-268 (surface-mount) | Determines board footprint, assembly method, and thermal path; a through-hole part is not a drop-in replacement for a surface-mount part. |
| Device Type | Fast recovery diode (FRED) | Fast recovery diode (FRED) | Confirms both parts serve the same rectification/freewheeling function, a prerequisite for substitutability. |
| Repetitive Peak Reverse Voltage (Vrrm) | 600 V | 600 V | Sets the maximum reverse blocking voltage; matching ratings ensure equivalent voltage margin in the application. |
| Average Forward Current (If(av)) | 30 A | 30 A | Defines the continuous current capability; equal ratings mean comparable load handling. |
| Forward Voltage Drop (Vf) | ~1.5 V (at rated current) | ~1.5 V (at rated current) | Affects conduction losses and efficiency; similar Vf keeps thermal and efficiency behavior comparable. |
| Reverse Recovery Time (trr) | Fast recovery (typ. tens of ns) | Fast recovery (typ. tens of ns) | Short trr reduces switching losses and EMI in high-frequency circuits; comparable trr supports similar switching performance. |
| Thermal Resistance (Rthjc) | Package-dependent junction-to-case value | Package-dependent junction-to-case value | Governs heat dissipation capability; differing package thermal paths affect required heatsinking. |
| Mounting / Assembly | Through-hole (PCB or heatsink mounting) | Surface-mount (reflow to PCB) | Assembly process compatibility is essential; the two parts require different manufacturing flows. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | APT30DQ60BG | APT30GS60KRG |
|---|---|---|
| Supplier | - | Microchip Technology |
| Part Status | Active | Obsolete |
| IGBT Type | - | NPT |
| Voltage - Collector Emitter Breakdown(Max) | - | 600 V |
| Current - Collector(Ic)(Max) | - | 54 A |
| Current - Collector Pulsed(Icm) | - | 113 A |
| Vce(on)(Max) @ Vge Ic | - | 3.15V @ 15V, 30A |
| Power - Max | - | 250 W |
| Switching Energy | - | 570µJ (off) |
| Input Type | - | Standard |
| Gate Charge | - | 145 nC |
| Td(on / off) @ 25°C | - | 16ns/360ns |
| Test Condition | - | 400V, 30A, 9.1Ohm, 15V |
| Operating Temperature | - | -55°C ~ 150°C (TJ) |
| Mounting Type | Through Hole | Through Hole |
| Diode Type | Standard | - |
| Voltage - DC Reverse (Vr) (Max) | 600 V | - |
| Current - Average Rectified(Io) | 30A | - |
| Voltage - Forward (Vf) (Max) @ If | 2.4 V @ 30 A | - |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | - |
| Reverse Recovery Time (trr) | 30 ns | - |
| Current - Reverse Leakage @ Vr | 25 µA @ 600 V | - |
The APT30DQ60BG is a 600 V, 30 A ultrafast soft-recovery diode in a TO-247 package, while the APT30GS60KRG is a 600 V, 30 A ultrafast soft-recovery diode in a TO-220 package. The main differences are package type and thermal/mechanical characteristics, not the core semiconductor rating.
Both are rated at 600 V and 30 A with ultrafast soft-recovery characteristics, so they are electrically similar in many circuits. However, package differences (TO-247 vs TO-220) affect thermal resistance, mounting, and PCB layout, so interchangeability must be validated against the manufacturer datasheets for the specific design.
The APT30DQ60BG is supplied in a TO-247 package, and the APT30GS60KRG is supplied in a TO-220 package. The TO-247 typically offers lower thermal resistance and higher power dissipation capability, while the TO-220 is a smaller, lower-cost package with different mounting and heatsinking requirements.
Not without verification. The TO-220 package of the APT30GS60KRG has a different footprint, pin spacing, and thermal pad area than the TO-247 package of the APT30DQ60BG, so the PCB land pattern, heatsink mounting, and thermal design must be checked before substitution.
Both the APT30DQ60BG and APT30GS60KRG are rated for a repetitive peak reverse voltage of 600 V and an average forward current of 30 A, per the manufacturer's datasheet ratings.
The APT30DQ60BG in the TO-247 package generally supports higher power dissipation and lower junction-to-case thermal resistance than the TO-220 packaged APT30GS60KRG. The exact thermal limits should be confirmed from the respective datasheets for the intended operating conditions.
Both are described by the manufacturer as ultrafast soft-recovery diodes with similar 600 V / 30 A ratings. For precise reverse-recovery time, recovery charge, and forward-voltage values, consult the individual datasheets, since these parameters can differ between package variants.