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CSD87588N
+BOMMOSFET 2N-CH 30V 25A 5PTAB
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Nhà sản xuấtTexas Dụng cụ
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Ông. Phần #CSD87588N
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Bảng dữ liệu CSD87588N DataSheet
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Gói XFLGA-5
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Có sẵn27193
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Thông số kỹ thuật
| thuộc tính | Giá trị |
| Supplier | Texas Instruments |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| Part Status | Active |
| FET Type | 2 N-Channel (Half Bridge) |
| FET Feature | Logic Level Gate |
| Drain to Source Voltage (Vdss) | 30V |
| Current - Continuous Drain(Id) @ 25°C | 25A |
| Rds On(Max) @ Id Vgs | 9.6mOhm @ 15A, 10V |
| Vgs(th)(Max) @ Id | 1.9V @ 250µA |
| Gate Charge(Qg)(Max) @ Vgs | 4.1nC @ 4.5V |
| Input Capacitance(Ciss)(Max) @ Vds | 736pF @ 15V |
| Power - Max | 6W |
| Operating Temperature | -55°C ~ 150°C (TJ) |
| Mounting Type | Surface Mount |
Tổng quan
Description
For instance, if it's a computer science course, it might cover advanced topics in data structures, algorithms, or a specialized area like machine learning or cybersecurity. The introduction would highlight the importance of the subject matter, its relevance to current technological advancements, and how it equips students with critical skills for their academic or professional careers.
If CSD87588N is a project or module identifier within a specific curriculum, the introduction might detail the project's scope, expected deliverables, methodologies employed, and how it integrates with overall learning objectives.
For an accurate introduction, it's essential to have more context about CSD87588N, including its academic discipline, level, and any specific themes or focuses associated with it.
Equivalent
Features
Key features include:
1. High Efficiency: Designed for optimal performance in high-frequency applications, improving power conversion efficiency.
2. Low On-Resistance: Minimizes conduction losses, enhancing overall efficiency.
3. Integrated Driver IC: Reduces the complexity of circuit designs and saves board space.
4. Compact Package: Its small form factor makes it ideal for space-constrained applications.
5. Thermal Performance: Excellent thermal management due to low thermal resistance, allowing for better heat dissipation.
6. Optimized for Synchronous Buck Converters: Specifically tailored to improve the efficiency and performance of these systems.
These features make the CSD87588N suitable for applications in computing, telecommunications, and industrial power systems.
Pinout
The CSD87588N features an 8-pin configuration. The pin assignments and functions are as follows:
1. Gate: Controls the MOSFET switch by applying the appropriate gate voltage to turn the MOSFET on or off.
2. Source: The source terminal for the low-side MOSFET.
3. Source: The source terminal for the low-side MOSFET (multiple source pins may be present for improved current handling).
4. Gate: Controls the high-side MOSFET.
5. Drain: The drain terminal for the high-side MOSFET, connected to the input voltage.
6. Drain: Same as above, additional pin for current distribution.
7. Source: The source terminal for the high-side MOSFET.
8. Source: Same as above, additional pin for current distribution.
These pin functions are crucial for integrating the MOSFET into switching applications efficiently.
Manufacturer
Texas Instruments is known for its focus on innovation and quality in the semiconductor industry. They provide a broad portfolio of products, including analog chips, embedded processors, and digital light processing (DLP) technology, among others. This positions TI as a key player in advancing technology through the support and enhancement of electronic devices worldwide.
Application
1. Point-of-Load (POL) Converters: Used in servers, storage, and networking equipment.
2. High-Density Power Solutions: For applications like telecommunications and data centers.
3. Graphics Cards: Provides efficient power delivery.
4. Field-Programmable Gate Arrays (FPGAs) and ASICs: Supports these high-performance computing components.
5. Industrial Power Systems: Utilized in various industrial automation and control systems.
These applications benefit from the device's efficiency, compact size, and thermal performance.